CFP for Wireless Communications Symposium (WCS)

Symposium Co-Chairs

• Masahiro Umehira
  Department of Media and Telecommunications Engineering, Ibaraki University, JAPAN
  umehira@mx.ibaraki.ac.jp
• Fulvio Babich
  Department of Elettrotecnica Elettronica Informatica, University of Trieste, ITALY
  babich@univ.trieste.it
• Sonia Aissa
  INRS, University of Quebec, Canada
  sonia.aissa@ieee.org
• Hai Lin
  Department of Electrical and Information Systems, Osaka Prefecture University
  hai.lin@ieee.org
Ashutosh Sabharwal
Rice University, USA
email address
• Xianbin Wang
  Department of Electrical and Computer Engineering, The University of Western Ontario London, CANADA
  wang@eng.uwo.ca

Scope and Motivation

The Wireless Communications Symposium will cover all aspects related to wireless communications and its applications, with a focus on topics related to Physical layer (PHY), MAC layer, Cross-layer, and Physical layer-related network analysis and design. High quality papers reporting on novel and practical solutions to PHY, MAC and cross-layer design in wireless communication systems are encouraged. In addition, papers on field tests and measurements, field trials and applications from both industries and academia are of special interest. To ensure complete coverage of the advances in wireless communications technologies for current and future wireless systems, the Wireless Communications Symposium cordially invites original contributions in, but not limited to, the following topical areas:

Main Topics of Interest

• Modulation, coding, and diversity techniques
• Cognitive radio and software defined radio
• Ultra-wideband communications (UWB)
• MIMO and multi-antenna communications
• Multi-user MIMO
• Space-time coding and processing
• OFDM and multi-carrier systems
• Advanced equalization for single carrier systems
• Smart Antennas
• Wireless Air Interface and Link Control
• CDMA, TDMA, FDMA, OFDMA air interfaces
• Detection and estimation
• Cross-layer design and physical layer based network Issues
• Security issues related to wireless communications
• Localization Techniques
• Distributed multipoint, relay assisted, and cooperative communications
• Wireless communications testbed development
• Field tests and measurements
• Network coding
• Opportunistic spectrum access
• Wireless multicasting
• Hybrid wireless communication systems
• Broadband wireless access techniques
• Physical-layer aspects of wireless LANsand PANs
• Body Area Networks (BAN) and its applications
• Advances in millimeter wave wireless LANs and PANs
• RFID and its applications
• Physical-layer aspects of cellular networks such as IMT2000, UMTS, LTE, IMT-Advanced
• DVB and DAB techniques
• Dynamic spectrum access
• Standardizations on wireless systems
• Coexistence in unlicensed spectra
• Radio resource management and interference control
• Fixed wireless broadband access systems
• WPAN applications
• Spectrum efficiency and issues
• Wireless multimedia and QoS
• Multiple access techniques
• Integration between satellite and terrestrial wireless networks

Technical Program Committee

• Marwen Abdennebi, L2TI Laboratory, University of Paris Nord, France
• Fumiyuki Adachi, Tohoku University, Japan
• Koichi Adachi, Institute for Infocomm Research (I2R), Singapore
• Vaneet Aggarwal, AT&T Labs - Research, USA
• Mohamed Hossam Ahmed, Memorial University, Canada
• Sonia Aissa, University of Quebec, INRS-EMT, Canada
• Defne Aktas, Bilkent University, Turkey
• Hussein Alnuweiri, Texas A&M University, Qatar
• Emad Alsusa, Manchester University, United Kingdom
• Ghassane Aniba, Mohammadia Engineering School, Morocco
• Alagan Anpalagan, Ryerson University, Canada
• Masoud Ardakani, University of Alberta, Canada
• Nallanathan Arumugam, King's College London, United Kingdom
• Takahiro Asai, NTT DoCoMo, Inc., Japan
• Amir Avestimehr, Cornell University, USA
• Sibi Raj B Pillai, IIT Bombay, India
• Fulvio Babich, University of Trieste, Italy
• Faouzi Bader, CTTC, Spain
• Zhiquan Bai, Shandong University, P.R. China
• Adrish Banerjee, Indian Institute of Technology, Kanpur, India
• Norman Beaulieu, University of Alberta, Canada
• Nevio Benvenuto, University of Padova, Italy
• Srikrishna Bhashyam, Indian Institute of Technology Madras, India
• Igor Bisio, University of Genoa, Italy
• Holger Boche, Technical University Munich, Germany
• Hanna Bogucka, Poznan University of Technology, Poland
• Jaber Borran, Qualcomm, USA
• Alister Burr, University of York, United Kingdom
• Chin Choy Chai, Institute for Infocomm Research, Singapore
• Benoit Champagne, McGill University, Canada
• Lan Chen, DOCOMO Beijing Communication Laboratories Co., Ltd, P.R. China
• Sheng Chen, University of Southampton, United Kingdom
• Wen Chen, Shanghai Jiaotong Uuniversity, P.R. China
• Woon Hau Chin, Toshiba Research Europe Limited, United Kingdom
• A. Chockalingam, Indian Institute of Science, India
• Chia-Chin Chong, DOCOMO USA Labs, USA
• Jean-Yves Chouinard, Laval University, Canada
• Kah Chung, Curtin University of Technology, Australia
• Sae-Young Chung, KAIST, Korea
• Marian Codreanu, University of Oulu, Finland
• Giulio Colavolpe, University of Parma, Italy
• Todd Coleman, University of Illinois, USA
• Massimiliano Comisso, University of Trieste, Italy
• Andrea Conti, ENDIF University of Ferrara, WiLAB University of Bologna, Italy
• Giovanni Emanuele Corazza, University of Bologna, Italy
• Paul Cotae, University of The District of Columbia, USA
• Marco D'Orlando, University of Trieste, Italy
• Onkar Dabeer, Tata Institute of Fundamental Research, India
• Arek Dadej, University of South Australia, Australia
• Lin Dai, City University of Hong Kong, Hong Kong
• Ngoc-Dung Dao, Huawei Technologies Canada Co., Ltd., Canada
• Davide Dardari, University of Bologna, Italy
• Zaher Dawy, American University of Beirut, Lebanon
• Satoshi Denno, Kyoto University, Japan
• Bikash Dey, Indian Institute of Technology Bombay, India
• Ugo Dias, University of Brasilia, Brazil
• Rui Dinis, ISR-IST, Technical University of Lisbon, Portugal
• Octavia Dobre, Memorial University of Newfoundland, Canada
• George Efthymoglou, University of Piraeus, Greece
• Maged Elkashlan, CSIRO, ICT Centre, Australia
• Ahmed Eltawil, University of California, Irvine, USA
• Serhat Erkucuk, Kadir Has University, Turkey
• Tomaso Erseghe, University of Padova, Italy
• Pingyi Fan, Tsinghua University, P.R. China
• Feifei Gao, Jacobs University, Bremen, Germany
• Jingbo Gao, University of Liverpool, United Kingdom
• Kannan Govindan, University of California Davis, USA
• Ozgur Gurbuz, Sabanci University, Turkey
• Bechir Hamdaoui, Oregon State University, USA
• Khairi Hamdi, University of Manchester, United Kingdom
• Lajos Hanzo, University of Southampton, United Kingdom
• Shinsuke Hara, Osaka City University, Japan
• Hiroshi Harada, National Institute of Information & Communications Technology (NICT), Japan
• Kazunori Hayashi, Kyoto University, Japan
• Jianhua He, Swansea University, United Kingdom
• Albert Heuberger, Technische Universitat Ilmenau, Germany
• Are Hjørungnes, University of Oslo, Norway
• Chin Keong Ho, Institute for Infocomm Research, Singapore
• Paul Ho, Simon Fraser University, Canada
• Yao-Win Peter Hong, National Tsing Hua University, Taiwan
• Hung-Yun Hsieh, National Taiwan University, Taiwan
• Jianwei Huang, The Chinese University of Hong Kong, Hong Kong
• Xiaoxia Huang, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, P.R. China
• Tetsushi Ikegami, Meiji University, Japan
• Masugi Inoue, National Institute of Information and Communications Technology, Japan
• Koji Ishibashi, Shizuoka University, Japan
• Koji Ishii, Kagawa University, Japan
• Tara Javidi, University of California, San Diego, USA
• Yusheng Ji, National Institute of Informatics, Japan
• Yuming Jiang, Norwegian University of Science and Technology (NTNU), Norway
• Yindi Jing, University of Alberta, Canada
• Volker Jungnickel, Fraunhofer Heinrich-Hertz-Institute, Germany
• Stefan Kaiser, DOCOMO Euro-Labs, Germany
• Thomas Kaiser, Leibniz University of Hannover, Germany
• Yoshikazu Kakura, NEC Corporation, Japan
• Pooi-Yuen Kam, National University of Singapore, Singapore
• Megumi Kaneko, Kyoto University, Japan
• Chung Kang, Korea University, Korea
• Kimmo Kansanen, Norwegian University of Science and Technology, Norway
• Masaaki Katayama, Nagoya University, Japan
• Shuzo Kato, Tohoku University, Japan
• Onur Kaya, Isik University, Turkey
• Hidetoshi Kayama, Ntt Docomo, Inc., Japan
• Andrew Kemp, University of Leeds, United Kingdom
• Chadi Khirallah, The University of Edinburgh, United Kingdom
• Ahmad Khoshnevis, IRCOMM / Sharp Laboratories of America, USA
• Jeongchang Kim, Korea Maritime University, Korea
• Michael Krause, University of Canterbury, New Zealand
• Hiroshi Kubo, Mitsubishi Electric Corporation, Japan
• Stepan Kucera, National Institute of Information and Communication Technology, Japan
• Volker Kuehn, University of Rostock, Germany
• Farshad Lahouti, University of Tehran, Iran
• Sangarapillai Lambotharan, Loughborough University, United Kingdom
• Lutz Lampe, University of British Columbia, Canada
• Erik G. Larsson, Linköping University, Sweden
• Matti Latva-aho, UoOulu, Finland
• Ming Lei, NEC Laboratories, P.R. China
• Chih-Peng Li, National Sun Yat-Sen University, Taiwan
• Hao Li, University of Western Ontario, Canada
• Jun Li, University of New South Wales, Australia
• Min Li, IMEC, Belgium
• Tongtong Li, Michigan State University, USA
• Yunxin (Jeff) Li, NICTA, Australia
• Che Lin, National Tsing Hua University, Taiwan
• Gui Lin, ShangHai JiaoTong University, P.R. China
• Bo-Chieh Liu, National Sun Yat-Sen University, Taiwan
• Huaping Liu, Oregon State University, USA
• Youjian (Eugene) Liu, University of Colorado at Boulder, USA
• Pavel Loskot, Swansea University, United Kingdom
• Vincenzo Lottici, University of Pisa, Italy
• Sergey Loyka, University of Ottawa, Canada
• Kejie Lu, University of Puerto Rico at Mayaguez, Puerto Rico
• Hsi-Pin Ma, National Tsing Hua University, Taiwan
• Shaodan Ma, The University of Hong Kong, P.R. China
• Wing-Kin Ma, The Chinese University of Hong Kong, Hong Kong
• Amine Maaref, Mitsubishi Electric Research Laboratories, USA
• Ranjan Mallik, Indian Institute of Technology - Delhi, India
• D. Manjunath, Indian Institute of Technology, Bombay, India
• Zhiwei Mao, Fairleigh Dickinson University, USA
• Philippa Martin, University of Canterbury, New Zealand
• Philippe Mary, European University of Brittany, INSA, IETR, France
• Peter Mason, DRDC-Ottawa, Canada
• Tad Matsumoto, Japan Advanced Institute of Science and Technology, Japan
• Hassan Moradi, University of Oklahoma, USA
• Hiroyuki Morikawa, The University of Tokyo, Japan
• Masahiro Morikura, Kyoto University, Japan
• Mehul Motani, National University of Singapore, Singapore
• Mohamed Moustafa, Akhbar El Yom Academy, Egypt
• Sami Muhaidat, Simon Fraser University, Canada
• Krishna Mukkavilli, Qualcomm Inc., USA
• Atsushi Murase, NTT docomo, Japan
• Hidekazu Murata, Kyoto University, Japan
• Leila Musavian, Loughborough University, United Kingdom
• Rohit Nabar, Marvell, USA
• Mohammed Nafie, Nile University, Egypt
• Ayman Naguib, Qualcomm Inc., USA
• Mohammad Nakhai, King's College London, United Kingdom
• Shusuke Narieda, Akashi National College of Technology, Japan
• Bala Natarajan, Kansas State University, USA
• Bobak Nazer, Boston University, USA
• Ha Nguyen, University of Saskatchewan, Canada
• Homayoun Nikookar, Delft University of Technology, The Netherlands
• Dusit Niyato, Nanyang Technological University, Singapore
• Hideki Ochiai, Yokohama National University, Japan
• Claude Oestges, Université catholique de Louvain, Belgium
• Yasutaka Ogawa, Hokkaido University, Japan
• Shigeaki Ogose, Kagawa University, Japan
• Wangrok Oh, Chungnam National University, Korea
• Masayoshi Ohashi, Advanced Telecommunications Research Institute International, Japan
• Shuichi Ohno, Hiroshima University, Japan
• Naoki Okamoto, SHARP corporation, Japan
• Sung Ik Park, Electronics and Telecommunications Research Institute (ETRI), Korea
• Matthias Pätzold, University of Agder, Norway
• Viet-Ha Pham, Laval University, Canada
• Petar Popovski, Aalborg University, Denmark
• Shankar Prakriya, Indian Institute of Technology, Delhi, India
• Serguei Primak, The University of Western Ontario, Canada
• Khalid Qaraqe, Texas A&M University at Qatar, USA
• Md. Jahidur Rahman, University of Western Ontario, Canada
• Sreeraman Rajan, Defence Research and Development Canada-Ottawa, Canada
• Bo Rong, Communications Research Center Canada, Canada
• Yue Rong, Curtin University, Australia
• Heung-Gyoon Ryu, Chungbuk National University, Korea
• Ashutosh Sabharwal, Rice University, USA
• Mirette Sadek, King Abdullah University of Science and Technology, Saudi Arabia
• Masato Saito, University of the Ryukyus, Japan
• Seiichi Sampei, Osaka University, Japan
• Fortunato Santucci, University of l'Aquila, Italy
• Cem Saraydar, General Motors R&D, USA
• Anand Sarwate, University of California, San Diego, USA
• Iwao Sasase, Keio University, Japan
• Mamoru Sawahashi, Tokyo City University, Japan
• Robert Schober, University of British Columbia, Canada
• Erchin Serpedin, Texas A&M University, USA
• Yue Shang, The MathWorks, USA
• Hyundong Shin, Kyung Hee University, Korea
• Kubota Shuji, Shibaura Institute of Technology, Japan
• Iickho Song, KAIST, Korea
• Jian Song, Tsinghua University, P.R. China
• Lingyang Song, Peking University, P.R. China
• Umberto Spagnolini, Politecnico di Milano, Italy
• Predrag Spasojevic, Rutgers University, USA
• Heidi Steendam, Ghent University, Belgium
• Mikael Sternad, Uppsala University, Sweden
• Hsuan-Jung Su, National Taiwan University, Taiwan
• Takatoshi Sugiyama, NTT, Japan
• Sumei Sun, Institute for Infocomm Research, Singapore
• Himal Suraweera, National University of Singapore, Singapore
• Hiroshi Suzuki, Tokyo Institute of Technology, Japan
• Yoshio Takeuchi, KDDI R&D Laboratories Inc., Japan
• Yasuhiko Tanabe, Toshiba Corporation, Japan
• Meixia Tao, Shanghai Jiao Tong University, P.R. China
• Makoto Taromaru, Fukuoka University, Japan
• Andrew Thangaraj, IIT Madras, India
• Bin Tian, Xidian University, P.R. China
• Antti Tölli, University of Oulu, Finland
• Velio Tralli, University of Ferrara - Italy, Italy
• Kazuhiro Uehara, NTT, Japan
• Murat Uysal, University of Waterloo, Canada
• Lorenzo Vangelista, University of Padova, Italy
• Giorgio M. Vitetta, University of Modena and Reggio Emilia, Italy
• Xiaodong Wang, Columbia University, USA
• Yue Wang, Toshiba Research Europe Limited, United Kingdom
• Zhongjun Wang, Wipro Techno Centre Singapore, Singapore
• Hung-Yu Wei, NTU, Taiwan
• Ying Weng, Imperial Colleage, United Kingdom
• Risto Wichman, Aalto university school of science and Technology, Finland
• Jwo-Yuh Wu, National Chiao Tung University, Taiwan
• Mingwei Wu, National University of Singapore, Singapore
• Xiang Wu, University of Edinburgh, United Kingdom
• Yik-Chung Wu, The University of Hong Kong, Hong Kong
• Alexander Wyglinski, Worcester Polytechnic Institute, USA
• Henk Wymeersch, Chalmers University of Technology, Sweden
• Minghua Xia, King Abdullah University of Science and Technology, Saudi Arabia
• Lei Xiao, Qualcomm, USA
• Gao Xinying, DOCOMO Beijing Communications Laboratories Co., Ltd, P.R. China
• Zhemin Xu, Broadcom Corporation, USA
• Koji Yamamoto, Kyoto University, Japan
• Yasushi Yamao, The University of Electro-Communications, Japan
• Chenyang Yang, Beihang University, P.R. China
• Kun Yang, University of Essex, United Kingdom
• Kar-Peo Yar, I2R, Singapore
• Ping-Cheng Yeh, National Taiwan University, Taiwan
• Changchuan Yin, Beijing University of Posts and Telecommunications, P.R. China
• Hiroyuki Yomo, Kansai University, Japan
• Makoto Yoshida, Fujitsu Laboratories Ltd., Japan
• Hitoshi Yoshino, Softbank Mobile Corporation, Japan
• Jinhong Yuan, University of New South Wales, Australia
• Chau Yuen, Singapore University of Technology and Design, Singapore
• Melda Yuksel, TOBB University of Economics and Technology, Turkey
• Alberto Zanella, Istituto di Elettronica e di Ingegneria dell'nform. e delle Telecomunicazioni, Italy
• Yonghong Zeng, Institute for Infocomm Research, Singapore
• Liang Zhang, Communications Research Centre Canada, Canada
• Liming Zheng, Tokyo Institute of Technology, Japan
• Yahong Zheng, Missouri University of Science and Technology, USA
• Yifeng Zhou, Communications Research Centre Canada, Canada
• Xu Zhu, University of Liverpool, United Kingdom