CFP for Wireless Networking Symposium (WNS)

Symposium Co-Chairs

• Mohammed Atiquzzaman
  School of Computer Science,University of Oklahoma, USA
  atiq@ou.edu
  
• Cheng Li
  Electrical and Computer Engineering,Memorial University of Newfoundland, Canada
  licheng@mun.ca
  
• Tarik Taleb
  NEC Europe
  Tarik.Taleb@neclab.eu
  
• Ping Wang
  School of Computer Engineering,Nanyang Technological University, Singapore
  wangping@ntu.edu.sg
  
• Mohamed Younis
  Department of Computer Science and Electrical Engineering, University of Maryland Baltimore County, USA
  younis@cs.umbc.edu
  

Scope and Motivation

Wireless networks are expected to encompass heterogeneous access technologies and the Internet backbone for providing services to both mobile and stationary users. It poses significant technical challenges to enable broadband wireless access with seamless and ubiquitous coverage and quality-of-service provisioning. The objective of this symposium is to serve as an international forum for experts from academia and industry to exchange ideas and results on research and development, and to promote and accelerate standardization, applications, and services of current and future wireless networks. Prospective authors are invited to submit original contributions on all aspects of wireless networks, applications and services, including, but not limited to, the following topics of interest. Please note that this Symposium focuses on research problems above the physical layer (although papers on cross-layer design/optimization are welcome). Papers solely addressing wireless communications problems at the physical layer should be submitted to other relevant symposia of IEEE ICC 2010.

Main Topics of Interest

Wireless access, network architecture, and standards

• Network architecture
• Network planning
• Broadband wireless access
• Cellular networks
• B3G/4G wireless networks
• WiMAX networks
• Wireless ad hoc and mesh networks
• Wireless local area networks
• Wireless personal area networks
• Ultra-wideband networks
• Wireless sensor networks
• Cognitive wireless networks
• Reconfigurable wireless networks
• Multimode wireless networks
• Vehicular wireless networks
• Home entertainment networks
• All-IP networks
• Ubiquitous coverage
• Integration of heterogeneous wireless and wireline networks

Network design, control, and performance

• Capacity analysis
• Quality-of-service provisioning
• Radio resource allocation
• Mobility, handoff, and location management
• Medium access control
• Traffic scheduling
• Access and admission control
• Routing
• Flow control and congestion control
• Energy efficiency
• Network clustering
• Network performance analysis
• Multimedia communications
• Traffic modeling and traffic management
• Cross-layer design and optimization
• Distributed control and management
• End-to-end protocols and performance
• Protocols and algorithms
• Power saving protocols
• Pricing and billing

Experiments, Applications, and Services

Multimedia applications over wireless networks
• Emerging wireless technologies
• New services and applications
• IPTV
• Measurements, testbeds, and deployment
• Wireless network standardization activities

Technical Program Committee

• Najah Abu Ali, UAE University, UAE
• Ahmed Ahmed, Zagazig University, Egypt
• Wessam Ajib, Université du Québec ä Montréal, Canada
• Arafat Al-Dweik, Khalifa University, UAE
• Attahiru Alfa, University of Manitoba, Canada
• Ali Almutairi, Kuwait University, Kuwait
• Nayef Alsindi, Bahrain Telecommunications Regulatory Authority, Bahrain
• Salah Aly, Princeton University, USA
• Habib M. Ammari, Hofstra University, USA
• Tricha Anjali, Illinois Institute of Technology, USA
• Huseyin Arslan, University of South Florida, USA
• Nils Aschenbruck, University of Bonn, Germany
• Mohammed Atiquzzaman, University of Oklahoma, USA
• Leonardo Badia, IMT Lucca Institute for Advanced Studies, Italy
• Saewoong Bahk, Seoul National University, Korea
• Ivan Bajic, Simon Fraser University, Canada
• Qutub Bakhtiar, Technological University of America, USA
• Mohammad Banat, Jordan University of Science and Technology, Jordan
• Luis Barbosa, Universidad de Castilla La Mancha, Spain
• Uthman Baroudi, King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia
• Mostafa Bassiouni, University of Central Florida, USA
• Gerhard Bauch, Universitaet der Bundeswehr Munich, Germany
• Osama Bazan, Ryerson University, Canada
• Lotfi Benmohamed, Johns Hopkins University Applied Physics Laboratory, USA
• Mauro Biagi, Sapienza University of Rome, Italy
• Aggelos Bletsas, Technical University of Crete, Greece
• Steven Blostein, Queen's University, Canada
• Fernando Boavida, University of Coimbra, Portugal
• Ali Boudani, DIGIPORT, France
• Mohammed Boulmalf, AlAkhawayn University in Ifrane, Morocco
• Chiara Buratti, University of Bologna, Italy
• Jianfei Cai, Nanyang Technological University, Singapore
• Jun Cai, University of Manitoba, Canada
• Lin Cai, University of waterloo, Canada
• Jiannong Cao, Hong Kong Polytechnic Univ, Hong Kong
• Lei Cao, The University of Mississippi, USA
• Claudio Casetti, Politecnico di Torino, Italy
• Erdal Cayirci, University of Stavanger, Norway
• Shih Yu Chang, National Tsing Hua University of Taiwan, Taiwan
• Hui Chen, Virginia State University, USA
• Jiming Chen, Zhejiang University, P.R. China
• Xi Chen, Memorial University of Newfoundland, Canada
• Xianbo Chen, Broadcom Corporation, USA
• Xiangqian Chen, Florida International University, USA
• Xiao Chen, Texas State University, USA
• Yu Chen, State University of New York - Binghamton, USA
• Yuanzhu Chen, Memorial University of Newfoundland, Canada
• Yunfei Chen, University of Warwick, United Kingdom
• Zesheng Chen, Indiana University - Purdue University Fort Wayne, USA
• Ho Ting Cheng, Huawei Technologies Canada, Canada
• Julian Cheng, University of British Columbia, Canada
• Feng-Tsun Chien, National Chiao Tung University, Taiwan
• Tzi-Dar Chiueh, National Taiwan University, Taiwan
• Justin Coon, Toshiba TRL, United Kingdom
• Laura Cottatellucci, Eurecom, France
• Felipe Cruz-Pérez, Cinvestav-IPN, Mexico
• Saumitra Das, Qualcomm Inc, USA
• Luca De Nardis, University of Rome La Sapienza, Italy
• Prathapasinghe Dharmawansa, Hong Kong University of Science and Technology, Hong Kong
• Marco Di Renzo, French National Center for Scientific Research (CNRS), France
• Mehrdad Dianati, University of Surrey, United Kingdom
• Wei Ding, Austin Peay State University, USA
• Min Dong, University of Ontario Institute of Technology, Canada
• Yu Dong, Florida International University, USA
• Chunjie Duan, Mitsubishi Electric Research Laboratories, USA
• Arjan Durresi, Indiana University Purdue University Indianapolis, USA
• Ehab Elmallah, University of Alberta, Canada
• Khaled Elsayed, Cairo University, Egypt
• Lorenzo Favalli, University of Pavia, Italy
• Gianluigi Ferrari, University of Parma, Italy
• Chuan Heng Foh, Nanyang Technological University, Singapore
• Shengli Fu, University of North Texas, USA
• Weihuang Fu, University of Cincinnati, USA
• Yasser Gadallah, UAE University, Egypt
• Laura Galluccio, University of Catania, Italy
• Weihua Gao, Qualcomm Inc., USA
• Thierry Gayraud, LAAS-CNRS, Université de Toulouse, France
• Paul Gendron, SSC-Pacific, USA
• Wolfgang Gerstacker, University of Erlangen-Nuernberg, Germany
• Khalida Ghanem, University of Southampton and University of Birmingham, United Kingdom
• Sahar Ghanem, Alexandria University, Egypt
• Paolo Giacomazzi, Politecnico di Milano, Italy
• Wesley Gifford, IBM Research, USA
• Kartik Gopalan, State University of New York at Binghamton, USA
• Javier Gozalvez, Universidad Miguel Hernandez de Elche, Spain
• Mina Guirguis, Texas State University, USA
• Martin Haardt, Ilmenau University of Technology, Germany
• Yassine Hadjadj-Aoul, University of Rennes 1, France
• Petr Hanacek, Brno University of Technology, Czech Republic
• Mohammad Heidari, Skyhook Wireless, USA
• Dominic K. C. Ho, University of Missouri - Columbia, USA
• Liang Hong, Tennessee State University, USA
• Xiaoyan Hong, University of Alabama, USA
• Zhihong Hong, Communications Research Centre, Canada
• Ekram Hossain, University of Manitoba, Canada
• Fen Hou, The Chinese University of Hong Kong, Hong Kong
• Xiaolin Hou, DOCOMO Beijing Communications Laboratories Co., Ltd, P.R. China
• Steve Hranilovic, McMaster University, Canada
• Rose Qingyang Hu, Utah State University, USA
• Cunqing Hua, Zhejiang University, P.R. China
• Defeng Huang, University of Western Australia, Australia
• Dijiang Huang, Arizona State University, USA
• Weimin Huang, Memorial University, Canada
• Brian Hughes, North Carolina State University, USA
• Ali Humos, Jackson State University, USA
• Salama Ikki, INRS, Canada
• Gi-Hong Im, POSTECH, Korea
• Lillykutty Jacob, National Institute of Technology Calicut, India
• Sarangapani Jagannathan, Missouri University of Science and Technology, USA
• Muhammad Jaseemuddin, Ryerson University, Canada
• Weijia Jia, City University of Hong Kong, P.R. China
• Xiaohua Jia, City University of Hong Kong, Hong Kong
• Vana Kalogeraki, University of California, Riverside, Greece
• Charles Kamhoua, Florida International University, USA
• Jaewon Kang, Telcordia Technologies, USA
• George Karagiannidis, Aristotle University of Thessaloniki, Greece
• Masoumeh Karimi, Technological University of America (TUA), USA
• Andreas J. Kassler, Karlstad University, Sweden
• Pete Keleher, University of Maryland, USA
• Tamer Khattab, Qatar University, Qatar
• Dong In Kim, Sungkyunkwan University, Korea
• Pansoo Kim, ETRI, Korea
• Joerg Kliewer, New Mexico State University, USA
• Adrian Kliks, Poznan University of Technology, Poland
• Thanasis Korakis, Polytechnic Institute of New York University, USA
• Polychronis Koutsakis, Technical University of Crete, Greece
• Ioannis Krikidis, University of Cyprus, Cyprus
• Witold Krzymień, University of Alberta / TRLabs, Electrical and Computer Engineering, Canada
• Adlen Ksentini, University of Rennes 1 / IRISA Lab, France
• Rakhesh Kshetrimayum, Indian Institute of Technology Guwahati, India
• Parag Kulkarni, Toshiba Research Europe Ltd., United Kingdom
• Thomas Kunz, Carleton University, Canada
• Yu-Kwong Kwok, University of Hong Kong, Hong Kong
• Miguel Labrador, University of South Florida, USA
• Yuri Labrador, Univision/FIU, USA
• Abderrahmane Lakas, UAEU, UAE
• Kaddar Lamia, University of Versailles Saint Quentin, France
• David Laurenson, The University of Edinburgh, United Kingdom
• Long Le, University of Quebec, Canada
• Long Le, NEC Laboratories Europe, Germany
• Zander Lei, Institute for Infocomm Research, Singapore
• Cheng Li, Memorial University of Newfoundland, Canada
• Hongxiang Li, North Darkota State University, USA
• Husheng Li, University of Tennessee, USA
• Jingli Li, TopWorx, USA
• Minming Li, City University of Hong Kong, Hong Kong
• Tiffany Jing Li, Lehigh University, USA
• Xu Li, State University of New York at Buffalo, USA
• Teng Joon Lim, University of Toronto, Canada
• Di Lin, McGill University, Canada
• Marco Listanti, University of Rome "La Sapienza", Italy
• Hai Liu, Hong Kong Baptist University, Hong Kong
• Qin Liu, Wuhan University, P.R. China
• Tsung-Hsien Liu, National Chung Cheng University, Taiwan
• Wei Liu, Huazhong University of Science and Technology, P.R. China
• Renato Lo Cigno, University of Trento, Italy
• David Love, Purdue University, USA
• Xiaoning Lu, Qualcomm, USA
• Marco Luise, University of Pisa, Italy
• Chung-Horng Lung, Carleton University, Canada
• Maurizio Magarini, Politecnico di Milano, Italy
• Dario Maggiorini, University of Milano, Italy
• Petri Mähönen, RWTH Aachen University, Germany
• Shiwen Mao, Auburn University, USA
• Patrick Marsch, Technische Universität Dresden, Germany
• Peter Martini, University of Bonn, Germany
• Barbara Masini, IEIIT-CNR, Italy
• Christos Masouros, Queen's University Belfast, United Kingdom
• Ahmed Meddahi, Institut Telecom/Telecom Lille 1, France
• Muralidhar Medidi, Boise State University, USA
• Sirisha Medidi, Boise State University, USA
• Natarajan Meghanathan, Jackson State University, USA
• Ahmed Mehaoua, University of Paris - Descartes, France
• Neelesh Mehta, Indian Institute of Science, India
• Jan Mietzner, EADS Deutschland GmbH, Germany
• Daniele Miorandi, Create-Net, Italy
• Vojislav Mišić, Ryerson University, Computer Science, Canada
• Satyajayant Misra, New Mexico State University, USA
• Amin Mobasher, Research In Motion, Canada
• Amr Mohamed, Qatar University, Qatar
• Seshadri Mohan, University of Arkansas at Little Rock, USA
• Hamed Mohsenian-Rad, Texas Tech University, USA
• Lizdabel Morales-Tirado, University of Puerto Rico, USA
• Stefan Moser, National Chiao Tung University (NCTU), Taiwan
• Ahmed Mostefaoui, University of Franche-Comté, France
• Lorenzo Mucchi, University of Florence, Italy
• Amitava Mukherjee, IBM India Pvt Ltd, Calcutta, India
• Kumudu Munasinghe, University of Sydney, Australia
• Amir Masoud Nasri Nasrabadi, University of British Columbia, Canada
• Edith Ngai, Uppsala University, Sweden
• Dragos Niculescu, Universitatea POLITEHNICA Bucuresti, Romania
• Ioanis Nikolaidis, University of Alberta, Canada
• Mirela Notare, Barddal University, Brazil
• Mohammad S. Obaidat, Monmouth University, USA
• Stephan Olariu, Old Dominion University, USA
• Frank Oldewurtel, RWTH Aachen University, Germany
• Shumao Ou, Oxford Brookes University, United Kingdom
• Ertan Özürk, Zonguldak Karaelmas University, Turkey
• Sangheon Pack, Korea University, Korea
• Elena Pagani, University of Milano, Italy
• Zhengang Pan, University of Hong Kong, Hong Kong
• Evangelos Papapetrou, University of Ioannina, Greece
• Gianni Pasolini, IEIIT-BO/CNR, University of Bologna, Italy
• Dongming Peng, University Nebraska - Lincoln, USA
• Wuxu Peng, Texas State University, USA
• Dirk Pesch, Cork Institute of Technology, Ireland
• Chiara Petrioli, University of Rome "La Sapienza", Italy
• Tom Pfeifer, Waterford Institute of Technology, TSSG, Ireland
• Lorenzo Piazzo, Universita' di Roma "La Sapienza", Italy
• Pedro Pinto, Massachusetts Institute of Technology, USA
• Niki Pissinou, Florida International University, USA
• Anand Prasad, NEC Corporation, Japan
• R Venkatesha Prasad, TU Delft - Delft University of Technology, The Netherlands
• Xin Qiu, Harbin Institute of Technology, P.R. China
• Guangzhi Qu, Oakland University, USA
• Redha Radaydeh, KAUST, Saudi Arabia
• Dinesh Rajan, Southern Methodist University, USA
• Marco Roccetti, University of Bologna, Italy
• Dario Rossi, TELECOM ParisTech, France
• Michele Rossi, University of Padova, Italy
• Brian Sadler, Army Research Laboratory, USA
• Djamel Sadok, Federal University of Pernambuco, Brazil
• Ehssan Sakhaee, Osaka University, Japan
• Farag Sallabi, UAE University, UAE
• Wiroonsak Santipach, Kasetsart University, Thailand
• Cesar Santivanez, BBN Technologies, USA
• Jochen Schiller, FU Berlin, Germany
• Jens Schmitt, University of Kaiserslautern, Germany
• Debarati Sen, Samsung India Software Operations, India
• Sidi-Mohammed Senouci, University of Bourgogne - ISAT Nevers, France
• Xuejun Sha, Communication Research Center, Harbin Institute of Technology, P.R. China
• Abdallah Shami, The University of Western Ontario, Canada
• Hangguan Shan, University of Waterloo, Canada
• Yi Shang, University of Missouri, USA
• Sanaa Sharafeddine, Lebanese American University, Lebanon
• Tarek Sheltami, KFUPM, Saudi Arabia
• Yi Shi, Virginia Tech, USA
• Claudio Silva, Virginia Tech, USA
• Isabelle Simplot-Ryl, University of Lille/INRIA, France
• Krishna Sivalingam, Indian Institute of Technology Madras, India
• Wei Song, University of New Brunswick, Canada
• Wen-Zhan Song, Georgia State University, USA
• Thomas Stockhammer, Nomor Research GmbH, Germany
• Zhou Su, Waseda University, Japan
• Hongxia Sun, University of Calgary, Canada
• Akshya Swain, University of Auckland, New Zealand
• Violet Syrotiuk, Arizona State University, USA
• Abd-Elhamid Taha, Queen's University, Canada
• Glen Takahara, Queen's University, Canada
• Mineo Takai, University of California, Los Angeles, USA
• Tarik Taleb, NEC Europe Ltd., Germany
• Jian Tang, Syracuse University, USA
• Daniele Tarchi, University of Bologna, Italy
• Chintha Tellambura, University of Alberta, Canada
• Ilenia Tinnirello, University of Palermo, Italy
• Jens Toelle, Fraunhofer FKIE / University of Bonn, Germany
• Andrea Tonello, University of Udine, Italy
• Ali Tosun, University of Texas at San Antonio, USA
• Stavros Toumpis, Athens University of Economics and Business, Greece
• Chih-Cheng Tseng, National Ilan University, Taiwan
• Hiroshi Tsunoda, Tohoku Institue of Technology, Japan
• Suleyman Uludag, The University of Michigan - Flint, USA
• Sennur Ulukus, University of Maryland, USA
• Fabrice Valois, INSA Lyon, France
• Athanasios Vasilakos, University of Western Macedonia, Greece
• Padmini Vellore, Memorial University of Newfoundland, Canada
• Véronique Vèque, University of Paris-Sud 11, France
• Mehmet Vuran, University of Nebraska-Lincoln, USA
• Bo Wang, Motorola, USA
• Chonggang Wang, InterDigital Communications, USA
• Dan Wang, The Hong Kong Polytechnic University, Hong Kong
• Dandan Wang, Huawei Technology (USA lab), USA
• Jianfeng Wang, Philips Research, USA
• Jingning Wang, The 54th Research Institute of China Electronics Technology Group Corporation, P.R. China
• Kuang-Ching Wang, Clemson University, USA
• Li-Chun Wang, National Chiao Tung University, Taiwan
• Ping Wang, Nanyang Technological University, Singapore
• Pu Wang, Georgia Institute of Technology, USA
• Tianqi Wang, University of Rochester, USA
• Tsang-Yi Wang, National Sun Yat-sen University, Taiwan
• Wei Wang, South Dakota State University, USA
• Weichao Wang, University of North Carolina at Charlotte, USA
• Wenye Wang, NC State University, USA
• Xianbin Wang, University of Western Ontario, Canada
• Cedric Westphal, Docomo Labs USA, USA
• Adam Wolisz, Technical University of Berlin, Germany
• Stephen Wolthusen, Royal Holloway, University of London, United Kingdom
• Kai Kit Wong, University College London, United Kingdom
• Vincent Wong, University of British Columbia, Canada
• Jinsong Wu, Queen's University at Kingston, Canada
• Xuanli Wu, Communication Research Center, Harbin Institute of Technology, P.R. China
• Tadeusz Wysocki, University of Nebraska - Lincoln, USA
• Liudong Xing, University of Massachusetts Dartmouth, USA
• Fang Yang, International Communication and Navigation (ICAN) Corporation, Canada
• Yang Yang, Shanghai Research Center for Wireless Communications, P.R. China
• Fei Ye, University Washington, USA
• Qiang Ye, University of Prince Edward Island, Canada
• Amr Youssef, Concordia University, Canada
• Moustafa Youssef, Egypt-Japan University of Science and Technology (E-JUST), Egypt
• Mei Yu, Tianjin University, P.R. China
• Qiyue Yu, Harbin Institute of Technology, P.R. China
• Wei Yuan, Huazhong University of Science and Technology, P.R. China
• Andrea Zanella, University of Padova, Italy
• Sherali Zeadally, University of the District of Columbia, USA
• Seyed (Reza) Zekavat, Michigan Technological University, USA
• Qing-An Zeng, North Carolina A&T State University, USA
• Baoxian Zhang, Graduate University of the Chinese Academy of Sciences, P.R. China
• Wei-Yi Zhang, North Dakota State University, USA
• Yongbing Zhang, University of Tsukuba, Japan
• Dongmei Zhao, McMaster University, Canada
• Jun Zheng, Southeast University, P.R. China
• Chi Zhou, Illinois Institute of Technology, USA
• Yuan Zhou, Huawei Technologies Co. Ltd, P.R. China
• Hao Zhu, Florida International University, USA
• Weihua Zhuang, University of Waterloo, Canada