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TPC members for Signal Processing for Communications Symposium (SPC)

  • Karim Abed-Meraim, Dept TSI, Télécom Paris, France
  • Saied Abedi, Fujitsu Laboratories of Europe, United Kingdom
  • Walid Ahmed, Broadcom Inc., USA
  • Abdeldjalil Aïssa-El-Bey, TELECOM Bretagne, France
  • Tarik Ait-Idir, INPT, Morocco
  • Maaruf Ali, Oxford Brookes University, United Kingdom
  • Abdullah Alqallaf, Kuwait University, Kuwait
  • Khoirul Anwar, Japan Advanced Institute of Science and Technology, Japan
  • Mohammed Benaissa, University of Sheffield, United Kingdom
  • Ahmed Bouridane, Northumbria UNiversity at Newcastle, United Kingdom
  • Said Boussakta, Newcastle University, United Kingdom
  • Wei Cao, Alcatel Shanghai Bell, P.R. China
  • Joseph Cavallaro, Rice University, USA
  • Volkan Cevher, Rice University, USA
  • Mrityunjoy Chakraborty, Indian Institute of Technology., Kharagpur, India
  • Yifan Chen, Newcastle University, United Kingdom
  • Jinho Choi, Swansea University, United Kingdom
  • Anand Dabak, DSPS R&D Texas Instruments, USA
  • Iyad Dayoub, University Lille Nord de France, France
  • Elisabeth de Carvalho, Aalborg University, Denmark
  • Luc Deneire, University of Nice, France
  • Tian-Bo Deng, Toho University, Japan
  • Claude Desset, IMEC, Belgium
  • Jaafar Elmirghani, University of Leeds, United Kingdom
  • Brian Evans, The University of Texas at Austin, USA
  • Anthony D. Fagan, University College Dublin, Ireland
  • Lisheng Fan, Shantou University, P.R. China
  • Kazuhiko Fukawa, Tokyo Institute of Technology, Japan
  • Javier Garcia-Frias, University of Delaware, USA
  • Saeed Gazor, Queen's University, Canada
  • Favier Gérard, Université de Nice, France
  • Abolfazl Ghassemi, Stanford University, USA
  • Irfan Ghauri, Infineon Technologies France, France
  • Gaetano Giunta, University of "Roma TRE", Italy
  • Mustafa Gurcan, Imperial College London, United Kingdom
  • Jianqiang He, Broadcom Inc., USA
  • Matthias Hesse, Nokia Siemens Networks, Poland
  • Kenichi Higuchi, Tokyo University of Science, Japan
  • Hakan Johansson, University of Linkoping, Sweden
  • Nadia Khaled, Swiss Federal Institute of Technology Lausanne, Switzerland
  • Navid Lashkarian, Broadcom Inc., USA
  • Hoa Le Minh, Northumbria University, United Kingdom
  • Didier Le Ruyet, CNAM, France
  • Hongbin Li, Stevens Tech, USA
  • Hai Lin, Osaka Prefecture University, Japan
  • Jia-Chin Lin, National Central University, Taiwan
  • Zhu Liu, AT&T Labs - Research, USA
  • Yves Louët, SUPELEC-Rennes Campus, France
  • Madjid Merabti, Liverpool John Moores University, United Kingdom
  • Joao Mota, UFC, Brazil
  • Wai Ho Mow, Hong Kong University of Science and Technology, Hong Kong
  • Wai Pang Ng, Northumbria University, United Kingdom
  • Hung Nguyen, The Aerospace Corporation, USA
  • Naohisa Ohta, Keio University, Japan
  • Balaji Raghothaman, Airvana, USA
  • Tharmalingam Ratnarajah, Queen's University of Belfast, United Kingdom
  • Takahiko Saba, Chiba Institute of Technology, Japan
  • Samir Saoudi, Telecom-Bretagne, France
  • Dilip Sarkar, University of Miami, USA
  • Laurent Schumacher, FUNDP - The University of Namur, Belgium
  • Mathini Sellathurai, Queen''s University of Belfast, United Kingdom
  • Byonghyo Shim, Korea University, Korea
  • Shigeru Shimamoto, Waseda University, Japan
  • Daniel K. C. So, University of Manchester, United Kingdom
  • M. Reza Soleymani, Concordia Univerisity, Canada
  • Ananthram Swami, Army Research Lab., USA
  • Leszek Szczecinski, INRS-EMT, Canada
  • Osamu Takyu, Tokyo University of Science, Japan
  • Tomohiko Taniguchi, Fujitsu Laboratories Ltd., Japan
  • Xiaofeng Tao, Beijing University of Posts and Telecommunications, P.R. China
  • John Thompson, University of Edinburgh, United Kingdom
  • Nghi Tran, McGill University, Canada
  • Charalampos Tsimenidis, Newcastle University, United Kingdom
  • Hideyuki Uehara, Toyohashi University of Technology, Japan
  • Guillaume Villemaud, Université de Lyon, INRIA, INSA-Lyon, CITI, France
  • Cheran Vithanage, Toshiba Research Europe Limited, United Kingdom
  • Chin-Liang Wang, National Tsing Hua University, Taiwan
  • Dong Wang, Philips Research North America, USA
  • Jiangzhou Wang, University of Kent, United Kingdom
  • Ian Wells, Swansea Metropolitan University, United Kingdom
  • Kainam Thomas Wong, Hong Kong Polytechnic University, Hong Kong
  • Hsiao-Chun Wu, Louisiana State University, USA
  • Jingxian Wu, University of Arkansas, USA
  • Zhiqiang Wu, Wright State University, USA
  • Xiang-Gen Xia, University of Delaware, USA
  • Chengwen Xing, Beijing Institute of Technology, P.R. China
  • Cuichun Xu, ARCON Corporation, USA
  • Donglai Xu, University of Teesside, United Kingdom
  • Yuriy Zakharov, University of York, United Kingdom
  • Azzedine Zerguine, KFUPM, Saudi Arabia
  • Jian-Kang Zhang, McMaster University, Canada
  • Li Zhang, University of Leeds, United Kingdom
  • Yimin Zhang, Villanova University, USA
  • Fu-Chun Zheng, The University of Reading, United Kingdom
  • Qiyue Zou, University of California, Los Angeles, USA




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