TPC members for Signal Processing for Communications Symposium (SPC)
- Karim Abed-Meraim, Dept TSI, Télécom Paris, France
- Saied Abedi, Fujitsu Laboratories of Europe, United Kingdom
- Walid Ahmed, Broadcom Inc., USA
- Abdeldjalil Aïssa-El-Bey, TELECOM Bretagne, France
- Tarik Ait-Idir, INPT, Morocco
- Maaruf Ali, Oxford Brookes University, United Kingdom
- Abdullah Alqallaf, Kuwait University, Kuwait
- Khoirul Anwar, Japan Advanced Institute of Science and Technology, Japan
- Mohammed Benaissa, University of Sheffield, United Kingdom
- Ahmed Bouridane, Northumbria UNiversity at Newcastle, United Kingdom
- Said Boussakta, Newcastle University, United Kingdom
- Wei Cao, Alcatel Shanghai Bell, P.R. China
- Joseph Cavallaro, Rice University, USA
- Volkan Cevher, Rice University, USA
- Mrityunjoy Chakraborty, Indian Institute of Technology., Kharagpur, India
- Yifan Chen, Newcastle University, United Kingdom
- Jinho Choi, Swansea University, United Kingdom
- Anand Dabak, DSPS R&D Texas Instruments, USA
- Iyad Dayoub, University Lille Nord de France, France
- Elisabeth de Carvalho, Aalborg University, Denmark
- Luc Deneire, University of Nice, France
- Tian-Bo Deng, Toho University, Japan
- Claude Desset, IMEC, Belgium
- Jaafar Elmirghani, University of Leeds, United Kingdom
- Brian Evans, The University of Texas at Austin, USA
- Anthony D. Fagan, University College Dublin, Ireland
- Lisheng Fan, Shantou University, P.R. China
- Kazuhiko Fukawa, Tokyo Institute of Technology, Japan
- Javier Garcia-Frias, University of Delaware, USA
- Saeed Gazor, Queen's University, Canada
- Favier Gérard, Université de Nice, France
- Abolfazl Ghassemi, Stanford University, USA
- Irfan Ghauri, Infineon Technologies France, France
- Gaetano Giunta, University of "Roma TRE", Italy
- Mustafa Gurcan, Imperial College London, United Kingdom
- Jianqiang He, Broadcom Inc., USA
- Matthias Hesse, Nokia Siemens Networks, Poland
- Kenichi Higuchi, Tokyo University of Science, Japan
- Hakan Johansson, University of Linkoping, Sweden
- Nadia Khaled, Swiss Federal Institute of Technology Lausanne, Switzerland
- Navid Lashkarian, Broadcom Inc., USA
- Hoa Le Minh, Northumbria University, United Kingdom
- Didier Le Ruyet, CNAM, France
- Hongbin Li, Stevens Tech, USA
- Hai Lin, Osaka Prefecture University, Japan
- Jia-Chin Lin, National Central University, Taiwan
- Zhu Liu, AT&T Labs - Research, USA
- Yves Louët, SUPELEC-Rennes Campus, France
- Madjid Merabti, Liverpool John Moores University, United Kingdom
- Joao Mota, UFC, Brazil
- Wai Ho Mow, Hong Kong University of Science and Technology, Hong Kong
- Wai Pang Ng, Northumbria University, United Kingdom
- Hung Nguyen, The Aerospace Corporation, USA
- Naohisa Ohta, Keio University, Japan
- Balaji Raghothaman, Airvana, USA
- Tharmalingam Ratnarajah, Queen's University of Belfast, United Kingdom
- Takahiko Saba, Chiba Institute of Technology, Japan
- Samir Saoudi, Telecom-Bretagne, France
- Dilip Sarkar, University of Miami, USA
- Laurent Schumacher, FUNDP - The University of Namur, Belgium
- Mathini Sellathurai, Queen''s University of Belfast, United Kingdom
- Byonghyo Shim, Korea University, Korea
- Shigeru Shimamoto, Waseda University, Japan
- Daniel K. C. So, University of Manchester, United Kingdom
- M. Reza Soleymani, Concordia Univerisity, Canada
- Ananthram Swami, Army Research Lab., USA
- Leszek Szczecinski, INRS-EMT, Canada
- Osamu Takyu, Tokyo University of Science, Japan
- Tomohiko Taniguchi, Fujitsu Laboratories Ltd., Japan
- Xiaofeng Tao, Beijing University of Posts and Telecommunications, P.R. China
- John Thompson, University of Edinburgh, United Kingdom
- Nghi Tran, McGill University, Canada
- Charalampos Tsimenidis, Newcastle University, United Kingdom
- Hideyuki Uehara, Toyohashi University of Technology, Japan
- Guillaume Villemaud, Université de Lyon, INRIA, INSA-Lyon, CITI, France
- Cheran Vithanage, Toshiba Research Europe Limited, United Kingdom
- Chin-Liang Wang, National Tsing Hua University, Taiwan
- Dong Wang, Philips Research North America, USA
- Jiangzhou Wang, University of Kent, United Kingdom
- Ian Wells, Swansea Metropolitan University, United Kingdom
- Kainam Thomas Wong, Hong Kong Polytechnic University, Hong Kong
- Hsiao-Chun Wu, Louisiana State University, USA
- Jingxian Wu, University of Arkansas, USA
- Zhiqiang Wu, Wright State University, USA
- Xiang-Gen Xia, University of Delaware, USA
- Chengwen Xing, Beijing Institute of Technology, P.R. China
- Cuichun Xu, ARCON Corporation, USA
- Donglai Xu, University of Teesside, United Kingdom
- Yuriy Zakharov, University of York, United Kingdom
- Azzedine Zerguine, KFUPM, Saudi Arabia
- Jian-Kang Zhang, McMaster University, Canada
- Li Zhang, University of Leeds, United Kingdom
- Yimin Zhang, Villanova University, USA
- Fu-Chun Zheng, The University of Reading, United Kingdom
- Qiyue Zou, University of California, Los Angeles, USA