ICC2011 logo

TPC members for Wireless Communications Symposium (WCS)

  • Marwen Abdennebi, L2TI Laboratory, University of Paris Nord, France
  • Fumiyuki Adachi, Tohoku University, Japan
  • Koichi Adachi, Institute for Infocomm Research (I2R), Singapore
  • Vaneet Aggarwal, AT&T Labs - Research, USA
  • Mohamed Hossam Ahmed, Memorial University, Canada
  • Sonia Aissa, University of Quebec, INRS-EMT, Canada
  • Defne Aktas, Bilkent University, Turkey
  • Hussein Alnuweiri, Texas A&M University, Qatar
  • Emad Alsusa, Manchester University, United Kingdom
  • Ghassane Aniba, Mohammadia Engineering School, Morocco
  • Alagan Anpalagan, Ryerson University, Canada
  • Masoud Ardakani, University of Alberta, Canada
  • Nallanathan Arumugam, King's College London, United Kingdom
  • Takahiro Asai, NTT DoCoMo, Inc., Japan
  • Amir Avestimehr, Cornell University, USA
  • Sibi Raj B Pillai, IIT Bombay, India
  • Fulvio Babich, University of Trieste, Italy
  • Faouzi Bader, CTTC, Spain
  • Zhiquan Bai, Shandong University, P.R. China
  • Adrish Banerjee, Indian Institute of Technology, Kanpur, India
  • Norman Beaulieu, University of Alberta, Canada
  • Nevio Benvenuto, University of Padova, Italy
  • Srikrishna Bhashyam, Indian Institute of Technology Madras, India
  • Igor Bisio, University of Genoa, Italy
  • Holger Boche, Technical University Munich, Germany
  • Hanna Bogucka, Poznan University of Technology, Poland
  • Jaber Borran, Qualcomm, USA
  • Alister Burr, University of York, United Kingdom
  • Chin Choy Chai, Institute for Infocomm Research, Singapore
  • Benoit Champagne, McGill University, Canada
  • Lan Chen, DOCOMO Beijing Communication Laboratories Co., Ltd, P.R. China
  • Sheng Chen, University of Southampton, United Kingdom
  • Wen Chen, Shanghai Jiaotong Uuniversity, P.R. China
  • Woon Hau Chin, Toshiba Research Europe Limited, United Kingdom
  • A. Chockalingam, Indian Institute of Science, India
  • Chia-Chin Chong, DOCOMO USA Labs, USA
  • Jean-Yves Chouinard, Laval University, Canada
  • Kah Chung, Curtin University of Technology, Australia
  • Sae-Young Chung, KAIST, Korea
  • Marian Codreanu, University of Oulu, Finland
  • Giulio Colavolpe, University of Parma, Italy
  • Todd Coleman, University of Illinois, USA
  • Massimiliano Comisso, University of Trieste, Italy
  • Andrea Conti, ENDIF University of Ferrara, WiLAB University of Bologna, Italy
  • Giovanni Emanuele Corazza, University of Bologna, Italy
  • Paul Cotae, University of The District of Columbia, USA
  • Marco D'Orlando, University of Trieste, Italy
  • Onkar Dabeer, Tata Institute of Fundamental Research, India
  • Arek Dadej, University of South Australia, Australia
  • Lin Dai, City University of Hong Kong, Hong Kong
  • Ngoc-Dung Dao, Huawei Technologies Canada Co., Ltd., Canada
  • Davide Dardari, University of Bologna, Italy
  • Zaher Dawy, American University of Beirut, Lebanon
  • Satoshi Denno, Kyoto University, Japan
  • Bikash Dey, Indian Institute of Technology Bombay, India
  • Ugo Dias, University of Brasilia, Brazil
  • Rui Dinis, ISR-IST, Technical University of Lisbon, Portugal
  • Octavia Dobre, Memorial University of Newfoundland, Canada
  • George Efthymoglou, University of Piraeus, Greece
  • Maged Elkashlan, CSIRO, ICT Centre, Australia
  • Ahmed Eltawil, University of California, Irvine, USA
  • Serhat Erkucuk, Kadir Has University, Turkey
  • Tomaso Erseghe, University of Padova, Italy
  • Pingyi Fan, Tsinghua University, P.R. China
  • Feifei Gao, Jacobs University, Bremen, Germany
  • Jingbo Gao, University of Liverpool, United Kingdom
  • Kannan Govindan, University of California Davis, USA
  • Ozgur Gurbuz, Sabanci University, Turkey
  • Bechir Hamdaoui, Oregon State University, USA
  • Khairi Hamdi, University of Manchester, United Kingdom
  • Lajos Hanzo, University of Southampton, United Kingdom
  • Shinsuke Hara, Osaka City University, Japan
  • Hiroshi Harada, National Institute of Information & Communications Technology (NICT), Japan
  • Kazunori Hayashi, Kyoto University, Japan
  • Jianhua He, Swansea University, United Kingdom
  • Albert Heuberger, Technische Universitat Ilmenau, Germany
  • Are Hjørungnes, University of Oslo, Norway
  • Chin Keong Ho, Institute for Infocomm Research, Singapore
  • Paul Ho, Simon Fraser University, Canada
  • Yao-Win Peter Hong, National Tsing Hua University, Taiwan
  • Hung-Yun Hsieh, National Taiwan University, Taiwan
  • Jianwei Huang, The Chinese University of Hong Kong, Hong Kong
  • Xiaoxia Huang, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, P.R. China
  • Tetsushi Ikegami, Meiji University, Japan
  • Masugi Inoue, National Institute of Information and Communications Technology, Japan
  • Koji Ishibashi, Shizuoka University, Japan
  • Koji Ishii, Kagawa University, Japan
  • Tara Javidi, University of California, San Diego, USA
  • Yusheng Ji, National Institute of Informatics, Japan
  • Yuming Jiang, Norwegian University of Science and Technology (NTNU), Norway
  • Yindi Jing, University of Alberta, Canada
  • Volker Jungnickel, Fraunhofer Heinrich-Hertz-Institute, Germany
  • Stefan Kaiser, DOCOMO Euro-Labs, Germany
  • Thomas Kaiser, Leibniz University of Hannover, Germany
  • Yoshikazu Kakura, NEC Corporation, Japan
  • Pooi-Yuen Kam, National University of Singapore, Singapore
  • Megumi Kaneko, Kyoto University, Japan
  • Chung Kang, Korea University, Korea
  • Kimmo Kansanen, Norwegian University of Science and Technology, Norway
  • Masaaki Katayama, Nagoya University, Japan
  • Shuzo Kato, Tohoku University, Japan
  • Onur Kaya, Isik University, Turkey
  • Hidetoshi Kayama, Ntt Docomo, Inc., Japan
  • Andrew Kemp, University of Leeds, United Kingdom
  • Chadi Khirallah, The University of Edinburgh, United Kingdom
  • Ahmad Khoshnevis, IRCOMM / Sharp Laboratories of America, USA
  • Jeongchang Kim, Korea Maritime University, Korea
  • Michael Krause, University of Canterbury, New Zealand
  • Hiroshi Kubo, Mitsubishi Electric Corporation, Japan
  • Stepan Kucera, National Institute of Information and Communication Technology, Japan
  • Volker Kuehn, University of Rostock, Germany
  • Farshad Lahouti, University of Tehran, Iran
  • Sangarapillai Lambotharan, Loughborough University, United Kingdom
  • Lutz Lampe, University of British Columbia, Canada
  • Erik G. Larsson, Linköping University, Sweden
  • Matti Latva-aho, UoOulu, Finland
  • Ming Lei, NEC Laboratories, P.R. China
  • Chih-Peng Li, National Sun Yat-Sen University, Taiwan
  • Hao Li, University of Western Ontario, Canada
  • Jun Li, University of New South Wales, Australia
  • Min Li, IMEC, Belgium
  • Tongtong Li, Michigan State University, USA
  • Yunxin (Jeff) Li, NICTA, Australia
  • Che Lin, National Tsing Hua University, Taiwan
  • Gui Lin, ShangHai JiaoTong University, P.R. China
  • Bo-Chieh Liu, National Sun Yat-Sen University, Taiwan
  • Huaping Liu, Oregon State University, USA
  • Youjian (Eugene) Liu, University of Colorado at Boulder, USA
  • Pavel Loskot, Swansea University, United Kingdom
  • Vincenzo Lottici, University of Pisa, Italy
  • Sergey Loyka, University of Ottawa, Canada
  • Kejie Lu, University of Puerto Rico at Mayaguez, Puerto Rico
  • Hsi-Pin Ma, National Tsing Hua University, Taiwan
  • Shaodan Ma, The University of Hong Kong, P.R. China
  • Wing-Kin Ma, The Chinese University of Hong Kong, Hong Kong
  • Amine Maaref, Mitsubishi Electric Research Laboratories, USA
  • Ranjan Mallik, Indian Institute of Technology - Delhi, India
  • D. Manjunath, Indian Institute of Technology, Bombay, India
  • Zhiwei Mao, Fairleigh Dickinson University, USA
  • Philippa Martin, University of Canterbury, New Zealand
  • Philippe Mary, European University of Brittany, INSA, IETR, France
  • Peter Mason, DRDC-Ottawa, Canada
  • Tad Matsumoto, Japan Advanced Institute of Science and Technology, Japan
  • Hassan Moradi, University of Oklahoma, USA
  • Hiroyuki Morikawa, The University of Tokyo, Japan
  • Masahiro Morikura, Kyoto University, Japan
  • Mehul Motani, National University of Singapore, Singapore
  • Mohamed Moustafa, Akhbar El Yom Academy, Egypt
  • Sami Muhaidat, Simon Fraser University, Canada
  • Krishna Mukkavilli, Qualcomm Inc., USA
  • Atsushi Murase, NTT docomo, Japan
  • Hidekazu Murata, Kyoto University, Japan
  • Leila Musavian, Loughborough University, United Kingdom
  • Rohit Nabar, Marvell, USA
  • Mohammed Nafie, Nile University, Egypt
  • Ayman Naguib, Qualcomm Inc., USA
  • Mohammad Nakhai, King's College London, United Kingdom
  • Shusuke Narieda, Akashi National College of Technology, Japan
  • Bala Natarajan, Kansas State University, USA
  • Bobak Nazer, Boston University, USA
  • Ha Nguyen, University of Saskatchewan, Canada
  • Homayoun Nikookar, Delft University of Technology, The Netherlands
  • Dusit Niyato, Nanyang Technological University, Singapore
  • Hideki Ochiai, Yokohama National University, Japan
  • Claude Oestges, Université catholique de Louvain, Belgium
  • Yasutaka Ogawa, Hokkaido University, Japan
  • Shigeaki Ogose, Kagawa University, Japan
  • Wangrok Oh, Chungnam National University, Korea
  • Masayoshi Ohashi, Advanced Telecommunications Research Institute International, Japan
  • Shuichi Ohno, Hiroshima University, Japan
  • Naoki Okamoto, SHARP corporation, Japan
  • Sung Ik Park, Electronics and Telecommunications Research Institute (ETRI), Korea
  • Matthias Pätzold, University of Agder, Norway
  • Viet-Ha Pham, Laval University, Canada
  • Petar Popovski, Aalborg University, Denmark
  • Shankar Prakriya, Indian Institute of Technology, Delhi, India
  • Serguei Primak, The University of Western Ontario, Canada
  • Khalid Qaraqe, Texas A&M University at Qatar, USA
  • Md. Jahidur Rahman, University of Western Ontario, Canada
  • Sreeraman Rajan, Defence Research and Development Canada-Ottawa, Canada
  • Bo Rong, Communications Research Center Canada, Canada
  • Yue Rong, Curtin University, Australia
  • Heung-Gyoon Ryu, Chungbuk National University, Korea
  • Ashutosh Sabharwal, Rice University, USA
  • Mirette Sadek, King Abdullah University of Science and Technology, Saudi Arabia
  • Masato Saito, University of the Ryukyus, Japan
  • Seiichi Sampei, Osaka University, Japan
  • Fortunato Santucci, University of l'Aquila, Italy
  • Cem Saraydar, General Motors R&D, USA
  • Anand Sarwate, University of California, San Diego, USA
  • Iwao Sasase, Keio University, Japan
  • Mamoru Sawahashi, Tokyo City University, Japan
  • Robert Schober, University of British Columbia, Canada
  • Erchin Serpedin, Texas A&M University, USA
  • Yue Shang, The MathWorks, USA
  • Hyundong Shin, Kyung Hee University, Korea
  • Kubota Shuji, Shibaura Institute of Technology, Japan
  • Iickho Song, KAIST, Korea
  • Jian Song, Tsinghua University, P.R. China
  • Lingyang Song, Peking University, P.R. China
  • Umberto Spagnolini, Politecnico di Milano, Italy
  • Predrag Spasojevic, Rutgers University, USA
  • Heidi Steendam, Ghent University, Belgium
  • Mikael Sternad, Uppsala University, Sweden
  • Hsuan-Jung Su, National Taiwan University, Taiwan
  • Takatoshi Sugiyama, NTT, Japan
  • Sumei Sun, Institute for Infocomm Research, Singapore
  • Himal Suraweera, National University of Singapore, Singapore
  • Hiroshi Suzuki, Tokyo Institute of Technology, Japan
  • Yoshio Takeuchi, KDDI R&D Laboratories Inc., Japan
  • Yasuhiko Tanabe, Toshiba Corporation, Japan
  • Meixia Tao, Shanghai Jiao Tong University, P.R. China
  • Makoto Taromaru, Fukuoka University, Japan
  • Andrew Thangaraj, IIT Madras, India
  • Bin Tian, Xidian University, P.R. China
  • Antti Tölli, University of Oulu, Finland
  • Velio Tralli, University of Ferrara - Italy, Italy
  • Kazuhiro Uehara, NTT, Japan
  • Murat Uysal, University of Waterloo, Canada
  • Lorenzo Vangelista, University of Padova, Italy
  • Giorgio M. Vitetta, University of Modena and Reggio Emilia, Italy
  • Xiaodong Wang, Columbia University, USA
  • Yue Wang, Toshiba Research Europe Limited, United Kingdom
  • Zhongjun Wang, Wipro Techno Centre Singapore, Singapore
  • Hung-Yu Wei, NTU, Taiwan
  • Ying Weng, Imperial Colleage, United Kingdom
  • Risto Wichman, Aalto university school of science and Technology, Finland
  • Jwo-Yuh Wu, National Chiao Tung University, Taiwan
  • Mingwei Wu, National University of Singapore, Singapore
  • Xiang Wu, University of Edinburgh, United Kingdom
  • Yik-Chung Wu, The University of Hong Kong, Hong Kong
  • Alexander Wyglinski, Worcester Polytechnic Institute, USA
  • Henk Wymeersch, Chalmers University of Technology, Sweden
  • Minghua Xia, King Abdullah University of Science and Technology, Saudi Arabia
  • Lei Xiao, Qualcomm, USA
  • Gao Xinying, DOCOMO Beijing Communications Laboratories Co., Ltd, P.R. China
  • Zhemin Xu, Broadcom Corporation, USA
  • Koji Yamamoto, Kyoto University, Japan
  • Yasushi Yamao, The University of Electro-Communications, Japan
  • Chenyang Yang, Beihang University, P.R. China
  • Kun Yang, University of Essex, United Kingdom
  • Kar-Peo Yar, I2R, Singapore
  • Ping-Cheng Yeh, National Taiwan University, Taiwan
  • Changchuan Yin, Beijing University of Posts and Telecommunications, P.R. China
  • Hiroyuki Yomo, Kansai University, Japan
  • Makoto Yoshida, Fujitsu Laboratories Ltd., Japan
  • Hitoshi Yoshino, Softbank Mobile Corporation, Japan
  • Jinhong Yuan, University of New South Wales, Australia
  • Chau Yuen, Singapore University of Technology and Design, Singapore
  • Melda Yuksel, TOBB University of Economics and Technology, Turkey
  • Alberto Zanella, Istituto di Elettronica e di Ingegneria dell'nform. e delle Telecomunicazioni, Italy
  • Yonghong Zeng, Institute for Infocomm Research, Singapore
  • Liang Zhang, Communications Research Centre Canada, Canada
  • Liming Zheng, Tokyo Institute of Technology, Japan
  • Yahong Zheng, Missouri University of Science and Technology, USA
  • Yifeng Zhou, Communications Research Centre Canada, Canada
  • Xu Zhu, University of Liverpool, United Kingdom




IEEE/IEICE 2011 | PAST CONFERENCES