TPC members for Wireless Communications Symposium (WCS)
- Marwen Abdennebi, L2TI Laboratory, University of Paris Nord, France
- Fumiyuki Adachi, Tohoku University, Japan
- Koichi Adachi, Institute for Infocomm Research (I2R), Singapore
- Vaneet Aggarwal, AT&T Labs - Research, USA
- Mohamed Hossam Ahmed, Memorial University, Canada
- Sonia Aissa, University of Quebec, INRS-EMT, Canada
- Defne Aktas, Bilkent University, Turkey
- Hussein Alnuweiri, Texas A&M University, Qatar
- Emad Alsusa, Manchester University, United Kingdom
- Ghassane Aniba, Mohammadia Engineering School, Morocco
- Alagan Anpalagan, Ryerson University, Canada
- Masoud Ardakani, University of Alberta, Canada
- Nallanathan Arumugam, King's College London, United Kingdom
- Takahiro Asai, NTT DoCoMo, Inc., Japan
- Amir Avestimehr, Cornell University, USA
- Sibi Raj B Pillai, IIT Bombay, India
- Fulvio Babich, University of Trieste, Italy
- Faouzi Bader, CTTC, Spain
- Zhiquan Bai, Shandong University, P.R. China
- Adrish Banerjee, Indian Institute of Technology, Kanpur, India
- Norman Beaulieu, University of Alberta, Canada
- Nevio Benvenuto, University of Padova, Italy
- Srikrishna Bhashyam, Indian Institute of Technology Madras, India
- Igor Bisio, University of Genoa, Italy
- Holger Boche, Technical University Munich, Germany
- Hanna Bogucka, Poznan University of Technology, Poland
- Jaber Borran, Qualcomm, USA
- Alister Burr, University of York, United Kingdom
- Chin Choy Chai, Institute for Infocomm Research, Singapore
- Benoit Champagne, McGill University, Canada
- Lan Chen, DOCOMO Beijing Communication Laboratories Co., Ltd, P.R. China
- Sheng Chen, University of Southampton, United Kingdom
- Wen Chen, Shanghai Jiaotong Uuniversity, P.R. China
- Woon Hau Chin, Toshiba Research Europe Limited, United Kingdom
- A. Chockalingam, Indian Institute of Science, India
- Chia-Chin Chong, DOCOMO USA Labs, USA
- Jean-Yves Chouinard, Laval University, Canada
- Kah Chung, Curtin University of Technology, Australia
- Sae-Young Chung, KAIST, Korea
- Marian Codreanu, University of Oulu, Finland
- Giulio Colavolpe, University of Parma, Italy
- Todd Coleman, University of Illinois, USA
- Massimiliano Comisso, University of Trieste, Italy
- Andrea Conti, ENDIF University of Ferrara, WiLAB University of Bologna, Italy
- Giovanni Emanuele Corazza, University of Bologna, Italy
- Paul Cotae, University of The District of Columbia, USA
- Marco D'Orlando, University of Trieste, Italy
- Onkar Dabeer, Tata Institute of Fundamental Research, India
- Arek Dadej, University of South Australia, Australia
- Lin Dai, City University of Hong Kong, Hong Kong
- Ngoc-Dung Dao, Huawei Technologies Canada Co., Ltd., Canada
- Davide Dardari, University of Bologna, Italy
- Zaher Dawy, American University of Beirut, Lebanon
- Satoshi Denno, Kyoto University, Japan
- Bikash Dey, Indian Institute of Technology Bombay, India
- Ugo Dias, University of Brasilia, Brazil
- Rui Dinis, ISR-IST, Technical University of Lisbon, Portugal
- Octavia Dobre, Memorial University of Newfoundland, Canada
- George Efthymoglou, University of Piraeus, Greece
- Maged Elkashlan, CSIRO, ICT Centre, Australia
- Ahmed Eltawil, University of California, Irvine, USA
- Serhat Erkucuk, Kadir Has University, Turkey
- Tomaso Erseghe, University of Padova, Italy
- Pingyi Fan, Tsinghua University, P.R. China
- Feifei Gao, Jacobs University, Bremen, Germany
- Jingbo Gao, University of Liverpool, United Kingdom
- Kannan Govindan, University of California Davis, USA
- Ozgur Gurbuz, Sabanci University, Turkey
- Bechir Hamdaoui, Oregon State University, USA
- Khairi Hamdi, University of Manchester, United Kingdom
- Lajos Hanzo, University of Southampton, United Kingdom
- Shinsuke Hara, Osaka City University, Japan
- Hiroshi Harada, National Institute of Information & Communications Technology (NICT), Japan
- Kazunori Hayashi, Kyoto University, Japan
- Jianhua He, Swansea University, United Kingdom
- Albert Heuberger, Technische Universitat Ilmenau, Germany
- Are Hjørungnes, University of Oslo, Norway
- Chin Keong Ho, Institute for Infocomm Research, Singapore
- Paul Ho, Simon Fraser University, Canada
- Yao-Win Peter Hong, National Tsing Hua University, Taiwan
- Hung-Yun Hsieh, National Taiwan University, Taiwan
- Jianwei Huang, The Chinese University of Hong Kong, Hong Kong
- Xiaoxia Huang, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, P.R. China
- Tetsushi Ikegami, Meiji University, Japan
- Masugi Inoue, National Institute of Information and Communications Technology, Japan
- Koji Ishibashi, Shizuoka University, Japan
- Koji Ishii, Kagawa University, Japan
- Tara Javidi, University of California, San Diego, USA
- Yusheng Ji, National Institute of Informatics, Japan
- Yuming Jiang, Norwegian University of Science and Technology (NTNU), Norway
- Yindi Jing, University of Alberta, Canada
- Volker Jungnickel, Fraunhofer Heinrich-Hertz-Institute, Germany
- Stefan Kaiser, DOCOMO Euro-Labs, Germany
- Thomas Kaiser, Leibniz University of Hannover, Germany
- Yoshikazu Kakura, NEC Corporation, Japan
- Pooi-Yuen Kam, National University of Singapore, Singapore
- Megumi Kaneko, Kyoto University, Japan
- Chung Kang, Korea University, Korea
- Kimmo Kansanen, Norwegian University of Science and Technology, Norway
- Masaaki Katayama, Nagoya University, Japan
- Shuzo Kato, Tohoku University, Japan
- Onur Kaya, Isik University, Turkey
- Hidetoshi Kayama, Ntt Docomo, Inc., Japan
- Andrew Kemp, University of Leeds, United Kingdom
- Chadi Khirallah, The University of Edinburgh, United Kingdom
- Ahmad Khoshnevis, IRCOMM / Sharp Laboratories of America, USA
- Jeongchang Kim, Korea Maritime University, Korea
- Michael Krause, University of Canterbury, New Zealand
- Hiroshi Kubo, Mitsubishi Electric Corporation, Japan
- Stepan Kucera, National Institute of Information and Communication Technology, Japan
- Volker Kuehn, University of Rostock, Germany
- Farshad Lahouti, University of Tehran, Iran
- Sangarapillai Lambotharan, Loughborough University, United Kingdom
- Lutz Lampe, University of British Columbia, Canada
- Erik G. Larsson, Linköping University, Sweden
- Matti Latva-aho, UoOulu, Finland
- Ming Lei, NEC Laboratories, P.R. China
- Chih-Peng Li, National Sun Yat-Sen University, Taiwan
- Hao Li, University of Western Ontario, Canada
- Jun Li, University of New South Wales, Australia
- Min Li, IMEC, Belgium
- Tongtong Li, Michigan State University, USA
- Yunxin (Jeff) Li, NICTA, Australia
- Che Lin, National Tsing Hua University, Taiwan
- Gui Lin, ShangHai JiaoTong University, P.R. China
- Bo-Chieh Liu, National Sun Yat-Sen University, Taiwan
- Huaping Liu, Oregon State University, USA
- Youjian (Eugene) Liu, University of Colorado at Boulder, USA
- Pavel Loskot, Swansea University, United Kingdom
- Vincenzo Lottici, University of Pisa, Italy
- Sergey Loyka, University of Ottawa, Canada
- Kejie Lu, University of Puerto Rico at Mayaguez, Puerto Rico
- Hsi-Pin Ma, National Tsing Hua University, Taiwan
- Shaodan Ma, The University of Hong Kong, P.R. China
- Wing-Kin Ma, The Chinese University of Hong Kong, Hong Kong
- Amine Maaref, Mitsubishi Electric Research Laboratories, USA
- Ranjan Mallik, Indian Institute of Technology - Delhi, India
- D. Manjunath, Indian Institute of Technology, Bombay, India
- Zhiwei Mao, Fairleigh Dickinson University, USA
- Philippa Martin, University of Canterbury, New Zealand
- Philippe Mary, European University of Brittany, INSA, IETR, France
- Peter Mason, DRDC-Ottawa, Canada
- Tad Matsumoto, Japan Advanced Institute of Science and Technology, Japan
- Hassan Moradi, University of Oklahoma, USA
- Hiroyuki Morikawa, The University of Tokyo, Japan
- Masahiro Morikura, Kyoto University, Japan
- Mehul Motani, National University of Singapore, Singapore
- Mohamed Moustafa, Akhbar El Yom Academy, Egypt
- Sami Muhaidat, Simon Fraser University, Canada
- Krishna Mukkavilli, Qualcomm Inc., USA
- Atsushi Murase, NTT docomo, Japan
- Hidekazu Murata, Kyoto University, Japan
- Leila Musavian, Loughborough University, United Kingdom
- Rohit Nabar, Marvell, USA
- Mohammed Nafie, Nile University, Egypt
- Ayman Naguib, Qualcomm Inc., USA
- Mohammad Nakhai, King's College London, United Kingdom
- Shusuke Narieda, Akashi National College of Technology, Japan
- Bala Natarajan, Kansas State University, USA
- Bobak Nazer, Boston University, USA
- Ha Nguyen, University of Saskatchewan, Canada
- Homayoun Nikookar, Delft University of Technology, The Netherlands
- Dusit Niyato, Nanyang Technological University, Singapore
- Hideki Ochiai, Yokohama National University, Japan
- Claude Oestges, Université catholique de Louvain, Belgium
- Yasutaka Ogawa, Hokkaido University, Japan
- Shigeaki Ogose, Kagawa University, Japan
- Wangrok Oh, Chungnam National University, Korea
- Masayoshi Ohashi, Advanced Telecommunications Research Institute International, Japan
- Shuichi Ohno, Hiroshima University, Japan
- Naoki Okamoto, SHARP corporation, Japan
- Sung Ik Park, Electronics and Telecommunications Research Institute (ETRI), Korea
- Matthias Pätzold, University of Agder, Norway
- Viet-Ha Pham, Laval University, Canada
- Petar Popovski, Aalborg University, Denmark
- Shankar Prakriya, Indian Institute of Technology, Delhi, India
- Serguei Primak, The University of Western Ontario, Canada
- Khalid Qaraqe, Texas A&M University at Qatar, USA
- Md. Jahidur Rahman, University of Western Ontario, Canada
- Sreeraman Rajan, Defence Research and Development Canada-Ottawa, Canada
- Bo Rong, Communications Research Center Canada, Canada
- Yue Rong, Curtin University, Australia
- Heung-Gyoon Ryu, Chungbuk National University, Korea
- Ashutosh Sabharwal, Rice University, USA
- Mirette Sadek, King Abdullah University of Science and Technology, Saudi Arabia
- Masato Saito, University of the Ryukyus, Japan
- Seiichi Sampei, Osaka University, Japan
- Fortunato Santucci, University of l'Aquila, Italy
- Cem Saraydar, General Motors R&D, USA
- Anand Sarwate, University of California, San Diego, USA
- Iwao Sasase, Keio University, Japan
- Mamoru Sawahashi, Tokyo City University, Japan
- Robert Schober, University of British Columbia, Canada
- Erchin Serpedin, Texas A&M University, USA
- Yue Shang, The MathWorks, USA
- Hyundong Shin, Kyung Hee University, Korea
- Kubota Shuji, Shibaura Institute of Technology, Japan
- Iickho Song, KAIST, Korea
- Jian Song, Tsinghua University, P.R. China
- Lingyang Song, Peking University, P.R. China
- Umberto Spagnolini, Politecnico di Milano, Italy
- Predrag Spasojevic, Rutgers University, USA
- Heidi Steendam, Ghent University, Belgium
- Mikael Sternad, Uppsala University, Sweden
- Hsuan-Jung Su, National Taiwan University, Taiwan
- Takatoshi Sugiyama, NTT, Japan
- Sumei Sun, Institute for Infocomm Research, Singapore
- Himal Suraweera, National University of Singapore, Singapore
- Hiroshi Suzuki, Tokyo Institute of Technology, Japan
- Yoshio Takeuchi, KDDI R&D Laboratories Inc., Japan
- Yasuhiko Tanabe, Toshiba Corporation, Japan
- Meixia Tao, Shanghai Jiao Tong University, P.R. China
- Makoto Taromaru, Fukuoka University, Japan
- Andrew Thangaraj, IIT Madras, India
- Bin Tian, Xidian University, P.R. China
- Antti Tölli, University of Oulu, Finland
- Velio Tralli, University of Ferrara - Italy, Italy
- Kazuhiro Uehara, NTT, Japan
- Murat Uysal, University of Waterloo, Canada
- Lorenzo Vangelista, University of Padova, Italy
- Giorgio M. Vitetta, University of Modena and Reggio Emilia, Italy
- Xiaodong Wang, Columbia University, USA
- Yue Wang, Toshiba Research Europe Limited, United Kingdom
- Zhongjun Wang, Wipro Techno Centre Singapore, Singapore
- Hung-Yu Wei, NTU, Taiwan
- Ying Weng, Imperial Colleage, United Kingdom
- Risto Wichman, Aalto university school of science and Technology, Finland
- Jwo-Yuh Wu, National Chiao Tung University, Taiwan
- Mingwei Wu, National University of Singapore, Singapore
- Xiang Wu, University of Edinburgh, United Kingdom
- Yik-Chung Wu, The University of Hong Kong, Hong Kong
- Alexander Wyglinski, Worcester Polytechnic Institute, USA
- Henk Wymeersch, Chalmers University of Technology, Sweden
- Minghua Xia, King Abdullah University of Science and Technology, Saudi Arabia
- Lei Xiao, Qualcomm, USA
- Gao Xinying, DOCOMO Beijing Communications Laboratories Co., Ltd, P.R. China
- Zhemin Xu, Broadcom Corporation, USA
- Koji Yamamoto, Kyoto University, Japan
- Yasushi Yamao, The University of Electro-Communications, Japan
- Chenyang Yang, Beihang University, P.R. China
- Kun Yang, University of Essex, United Kingdom
- Kar-Peo Yar, I2R, Singapore
- Ping-Cheng Yeh, National Taiwan University, Taiwan
- Changchuan Yin, Beijing University of Posts and Telecommunications, P.R. China
- Hiroyuki Yomo, Kansai University, Japan
- Makoto Yoshida, Fujitsu Laboratories Ltd., Japan
- Hitoshi Yoshino, Softbank Mobile Corporation, Japan
- Jinhong Yuan, University of New South Wales, Australia
- Chau Yuen, Singapore University of Technology and Design, Singapore
- Melda Yuksel, TOBB University of Economics and Technology, Turkey
- Alberto Zanella, Istituto di Elettronica e di Ingegneria dell'nform. e delle Telecomunicazioni, Italy
- Yonghong Zeng, Institute for Infocomm Research, Singapore
- Liang Zhang, Communications Research Centre Canada, Canada
- Liming Zheng, Tokyo Institute of Technology, Japan
- Yahong Zheng, Missouri University of Science and Technology, USA
- Yifeng Zhou, Communications Research Centre Canada, Canada
- Xu Zhu, University of Liverpool, United Kingdom