TPC members for Wireless Networking Symposium (WNS)
- Najah Abu Ali, UAE University, UAE
- Ahmed Ahmed, Zagazig University, Egypt
- Wessam Ajib, Université du Québec ä Montréal, Canada
- Arafat Al-Dweik, Khalifa University, UAE
- Attahiru Alfa, University of Manitoba, Canada
- Ali Almutairi, Kuwait University, Kuwait
- Nayef Alsindi, Bahrain Telecommunications Regulatory Authority, Bahrain
- Salah Aly, Princeton University, USA
- Habib M. Ammari, Hofstra University, USA
- Tricha Anjali, Illinois Institute of Technology, USA
- Huseyin Arslan, University of South Florida, USA
- Nils Aschenbruck, University of Bonn, Germany
- Mohammed Atiquzzaman, University of Oklahoma, USA
- Leonardo Badia, IMT Lucca Institute for Advanced Studies, Italy
- Saewoong Bahk, Seoul National University, Korea
- Ivan Bajic, Simon Fraser University, Canada
- Qutub Bakhtiar, Technological University of America, USA
- Mohammad Banat, Jordan University of Science and Technology, Jordan
- Luis Barbosa, Universidad de Castilla La Mancha, Spain
- Uthman Baroudi, King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia
- Mostafa Bassiouni, University of Central Florida, USA
- Gerhard Bauch, Universitaet der Bundeswehr Munich, Germany
- Osama Bazan, Ryerson University, Canada
- Lotfi Benmohamed, Johns Hopkins University Applied Physics Laboratory, USA
- Mauro Biagi, Sapienza University of Rome, Italy
- Aggelos Bletsas, Technical University of Crete, Greece
- Steven Blostein, Queen's University, Canada
- Fernando Boavida, University of Coimbra, Portugal
- Ali Boudani, DIGIPORT, France
- Mohammed Boulmalf, AlAkhawayn University in Ifrane, Morocco
- Chiara Buratti, University of Bologna, Italy
- Jianfei Cai, Nanyang Technological University, Singapore
- Jun Cai, University of Manitoba, Canada
- Lin Cai, University of waterloo, Canada
- Jiannong Cao, Hong Kong Polytechnic Univ, Hong Kong
- Lei Cao, The University of Mississippi, USA
- Claudio Casetti, Politecnico di Torino, Italy
- Erdal Cayirci, University of Stavanger, Norway
- Shih Yu Chang, National Tsing Hua University of Taiwan, Taiwan
- Hui Chen, Virginia State University, USA
- Jiming Chen, Zhejiang University, P.R. China
- Xi Chen, Memorial University of Newfoundland, Canada
- Xianbo Chen, Broadcom Corporation, USA
- Xiangqian Chen, Florida International University, USA
- Xiao Chen, Texas State University, USA
- Yu Chen, State University of New York - Binghamton, USA
- Yuanzhu Chen, Memorial University of Newfoundland, Canada
- Yunfei Chen, University of Warwick, United Kingdom
- Zesheng Chen, Indiana University - Purdue University Fort Wayne, USA
- Ho Ting Cheng, Huawei Technologies Canada, Canada
- Julian Cheng, University of British Columbia, Canada
- Feng-Tsun Chien, National Chiao Tung University, Taiwan
- Tzi-Dar Chiueh, National Taiwan University, Taiwan
- Justin Coon, Toshiba TRL, United Kingdom
- Laura Cottatellucci, Eurecom, France
- Felipe Cruz-Pérez, Cinvestav-IPN, Mexico
- Saumitra Das, Qualcomm Inc, USA
- Luca De Nardis, University of Rome La Sapienza, Italy
- Prathapasinghe Dharmawansa, Hong Kong University of Science and Technology, Hong Kong
- Marco Di Renzo, French National Center for Scientific Research (CNRS), France
- Mehrdad Dianati, University of Surrey, United Kingdom
- Wei Ding, Austin Peay State University, USA
- Min Dong, University of Ontario Institute of Technology, Canada
- Yu Dong, Florida International University, USA
- Chunjie Duan, Mitsubishi Electric Research Laboratories, USA
- Arjan Durresi, Indiana University Purdue University Indianapolis, USA
- Ehab Elmallah, University of Alberta, Canada
- Khaled Elsayed, Cairo University, Egypt
- Lorenzo Favalli, University of Pavia, Italy
- Gianluigi Ferrari, University of Parma, Italy
- Chuan Heng Foh, Nanyang Technological University, Singapore
- Shengli Fu, University of North Texas, USA
- Weihuang Fu, University of Cincinnati, USA
- Yasser Gadallah, UAE University, Egypt
- Laura Galluccio, University of Catania, Italy
- Weihua Gao, Qualcomm Inc., USA
- Thierry Gayraud, LAAS-CNRS, Université de Toulouse, France
- Paul Gendron, SSC-Pacific, USA
- Wolfgang Gerstacker, University of Erlangen-Nuernberg, Germany
- Khalida Ghanem, University of Southampton and University of Birmingham, United Kingdom
- Sahar Ghanem, Alexandria University, Egypt
- Paolo Giacomazzi, Politecnico di Milano, Italy
- Wesley Gifford, IBM Research, USA
- Kartik Gopalan, State University of New York at Binghamton, USA
- Javier Gozalvez, Universidad Miguel Hernandez de Elche, Spain
- Mina Guirguis, Texas State University, USA
- Martin Haardt, Ilmenau University of Technology, Germany
- Yassine Hadjadj-Aoul, University of Rennes 1, France
- Petr Hanacek, Brno University of Technology, Czech Republic
- Mohammad Heidari, Skyhook Wireless, USA
- Dominic K. C. Ho, University of Missouri - Columbia, USA
- Liang Hong, Tennessee State University, USA
- Xiaoyan Hong, University of Alabama, USA
- Zhihong Hong, Communications Research Centre, Canada
- Ekram Hossain, University of Manitoba, Canada
- Fen Hou, The Chinese University of Hong Kong, Hong Kong
- Xiaolin Hou, DOCOMO Beijing Communications Laboratories Co., Ltd, P.R. China
- Steve Hranilovic, McMaster University, Canada
- Rose Qingyang Hu, Utah State University, USA
- Cunqing Hua, Zhejiang University, P.R. China
- Defeng Huang, University of Western Australia, Australia
- Dijiang Huang, Arizona State University, USA
- Weimin Huang, Memorial University, Canada
- Brian Hughes, North Carolina State University, USA
- Ali Humos, Jackson State University, USA
- Salama Ikki, INRS, Canada
- Gi-Hong Im, POSTECH, Korea
- Lillykutty Jacob, National Institute of Technology Calicut, India
- Sarangapani Jagannathan, Missouri University of Science and Technology, USA
- Muhammad Jaseemuddin, Ryerson University, Canada
- Weijia Jia, City University of Hong Kong, P.R. China
- Xiaohua Jia, City University of Hong Kong, Hong Kong
- Vana Kalogeraki, University of California, Riverside, Greece
- Charles Kamhoua, Florida International University, USA
- Jaewon Kang, Telcordia Technologies, USA
- George Karagiannidis, Aristotle University of Thessaloniki, Greece
- Masoumeh Karimi, Technological University of America (TUA), USA
- Andreas J. Kassler, Karlstad University, Sweden
- Pete Keleher, University of Maryland, USA
- Tamer Khattab, Qatar University, Qatar
- Dong In Kim, Sungkyunkwan University, Korea
- Pansoo Kim, ETRI, Korea
- Joerg Kliewer, New Mexico State University, USA
- Adrian Kliks, Poznan University of Technology, Poland
- Thanasis Korakis, Polytechnic Institute of New York University, USA
- Polychronis Koutsakis, Technical University of Crete, Greece
- Ioannis Krikidis, University of Cyprus, Cyprus
- Witold Krzymień, University of Alberta / TRLabs, Electrical and Computer Engineering, Canada
- Adlen Ksentini, University of Rennes 1 / IRISA Lab, France
- Rakhesh Kshetrimayum, Indian Institute of Technology Guwahati, India
- Parag Kulkarni, Toshiba Research Europe Ltd., United Kingdom
- Thomas Kunz, Carleton University, Canada
- Yu-Kwong Kwok, University of Hong Kong, Hong Kong
- Miguel Labrador, University of South Florida, USA
- Yuri Labrador, Univision/FIU, USA
- Abderrahmane Lakas, UAEU, UAE
- Kaddar Lamia, University of Versailles Saint Quentin, France
- David Laurenson, The University of Edinburgh, United Kingdom
- Long Le, University of Quebec, Canada
- Long Le, NEC Laboratories Europe, Germany
- Zander Lei, Institute for Infocomm Research, Singapore
- Cheng Li, Memorial University of Newfoundland, Canada
- Hongxiang Li, North Darkota State University, USA
- Husheng Li, University of Tennessee, USA
- Jingli Li, TopWorx, USA
- Minming Li, City University of Hong Kong, Hong Kong
- Tiffany Jing Li, Lehigh University, USA
- Xu Li, State University of New York at Buffalo, USA
- Teng Joon Lim, University of Toronto, Canada
- Di Lin, McGill University, Canada
- Marco Listanti, University of Rome "La Sapienza", Italy
- Hai Liu, Hong Kong Baptist University, Hong Kong
- Qin Liu, Wuhan University, P.R. China
- Tsung-Hsien Liu, National Chung Cheng University, Taiwan
- Wei Liu, Huazhong University of Science and Technology, P.R. China
- Renato Lo Cigno, University of Trento, Italy
- David Love, Purdue University, USA
- Xiaoning Lu, Qualcomm, USA
- Marco Luise, University of Pisa, Italy
- Chung-Horng Lung, Carleton University, Canada
- Maurizio Magarini, Politecnico di Milano, Italy
- Dario Maggiorini, University of Milano, Italy
- Petri Mähönen, RWTH Aachen University, Germany
- Shiwen Mao, Auburn University, USA
- Patrick Marsch, Technische Universität Dresden, Germany
- Peter Martini, University of Bonn, Germany
- Barbara Masini, IEIIT-CNR, Italy
- Christos Masouros, Queen's University Belfast, United Kingdom
- Ahmed Meddahi, Institut Telecom/Telecom Lille 1, France
- Muralidhar Medidi, Boise State University, USA
- Sirisha Medidi, Boise State University, USA
- Natarajan Meghanathan, Jackson State University, USA
- Ahmed Mehaoua, University of Paris - Descartes, France
- Neelesh Mehta, Indian Institute of Science, India
- Jan Mietzner, EADS Deutschland GmbH, Germany
- Daniele Miorandi, Create-Net, Italy
- Vojislav Mišić, Ryerson University, Computer Science, Canada
- Satyajayant Misra, New Mexico State University, USA
- Amin Mobasher, Research In Motion, Canada
- Amr Mohamed, Qatar University, Qatar
- Seshadri Mohan, University of Arkansas at Little Rock, USA
- Hamed Mohsenian-Rad, Texas Tech University, USA
- Lizdabel Morales-Tirado, University of Puerto Rico, USA
- Stefan Moser, National Chiao Tung University (NCTU), Taiwan
- Ahmed Mostefaoui, University of Franche-Comté, France
- Lorenzo Mucchi, University of Florence, Italy
- Amitava Mukherjee, IBM India Pvt Ltd, Calcutta, India
- Kumudu Munasinghe, University of Sydney, Australia
- Amir Masoud Nasri Nasrabadi, University of British Columbia, Canada
- Edith Ngai, Uppsala University, Sweden
- Dragos Niculescu, Universitatea POLITEHNICA Bucuresti, Romania
- Ioanis Nikolaidis, University of Alberta, Canada
- Mirela Notare, Barddal University, Brazil
- Mohammad S. Obaidat, Monmouth University, USA
- Stephan Olariu, Old Dominion University, USA
- Frank Oldewurtel, RWTH Aachen University, Germany
- Shumao Ou, Oxford Brookes University, United Kingdom
- Ertan Özürk, Zonguldak Karaelmas University, Turkey
- Sangheon Pack, Korea University, Korea
- Elena Pagani, University of Milano, Italy
- Zhengang Pan, University of Hong Kong, Hong Kong
- Evangelos Papapetrou, University of Ioannina, Greece
- Gianni Pasolini, IEIIT-BO/CNR, University of Bologna, Italy
- Dongming Peng, University Nebraska - Lincoln, USA
- Wuxu Peng, Texas State University, USA
- Dirk Pesch, Cork Institute of Technology, Ireland
- Chiara Petrioli, University of Rome "La Sapienza", Italy
- Tom Pfeifer, Waterford Institute of Technology, TSSG, Ireland
- Lorenzo Piazzo, Universita' di Roma "La Sapienza", Italy
- Pedro Pinto, Massachusetts Institute of Technology, USA
- Niki Pissinou, Florida International University, USA
- Anand Prasad, NEC Corporation, Japan
- R Venkatesha Prasad, TU Delft - Delft University of Technology, The Netherlands
- Xin Qiu, Harbin Institute of Technology, P.R. China
- Guangzhi Qu, Oakland University, USA
- Redha Radaydeh, KAUST, Saudi Arabia
- Dinesh Rajan, Southern Methodist University, USA
- Marco Roccetti, University of Bologna, Italy
- Dario Rossi, TELECOM ParisTech, France
- Michele Rossi, University of Padova, Italy
- Brian Sadler, Army Research Laboratory, USA
- Djamel Sadok, Federal University of Pernambuco, Brazil
- Ehssan Sakhaee, Osaka University, Japan
- Farag Sallabi, UAE University, UAE
- Wiroonsak Santipach, Kasetsart University, Thailand
- Cesar Santivanez, BBN Technologies, USA
- Jochen Schiller, FU Berlin, Germany
- Jens Schmitt, University of Kaiserslautern, Germany
- Debarati Sen, Samsung India Software Operations, India
- Sidi-Mohammed Senouci, University of Bourgogne - ISAT Nevers, France
- Xuejun Sha, Communication Research Center, Harbin Institute of Technology, P.R. China
- Abdallah Shami, The University of Western Ontario, Canada
- Hangguan Shan, University of Waterloo, Canada
- Yi Shang, University of Missouri, USA
- Sanaa Sharafeddine, Lebanese American University, Lebanon
- Tarek Sheltami, KFUPM, Saudi Arabia
- Yi Shi, Virginia Tech, USA
- Claudio Silva, Virginia Tech, USA
- Isabelle Simplot-Ryl, University of Lille/INRIA, France
- Krishna Sivalingam, Indian Institute of Technology Madras, India
- Wei Song, University of New Brunswick, Canada
- Wen-Zhan Song, Georgia State University, USA
- Thomas Stockhammer, Nomor Research GmbH, Germany
- Zhou Su, Waseda University, Japan
- Hongxia Sun, University of Calgary, Canada
- Akshya Swain, University of Auckland, New Zealand
- Violet Syrotiuk, Arizona State University, USA
- Abd-Elhamid Taha, Queen's University, Canada
- Glen Takahara, Queen's University, Canada
- Mineo Takai, University of California, Los Angeles, USA
- Tarik Taleb, NEC Europe Ltd., Germany
- Jian Tang, Syracuse University, USA
- Daniele Tarchi, University of Bologna, Italy
- Chintha Tellambura, University of Alberta, Canada
- Ilenia Tinnirello, University of Palermo, Italy
- Jens Toelle, Fraunhofer FKIE / University of Bonn, Germany
- Andrea Tonello, University of Udine, Italy
- Ali Tosun, University of Texas at San Antonio, USA
- Stavros Toumpis, Athens University of Economics and Business, Greece
- Chih-Cheng Tseng, National Ilan University, Taiwan
- Hiroshi Tsunoda, Tohoku Institue of Technology, Japan
- Suleyman Uludag, The University of Michigan - Flint, USA
- Sennur Ulukus, University of Maryland, USA
- Fabrice Valois, INSA Lyon, France
- Athanasios Vasilakos, University of Western Macedonia, Greece
- Padmini Vellore, Memorial University of Newfoundland, Canada
- Véronique Vèque, University of Paris-Sud 11, France
- Mehmet Vuran, University of Nebraska-Lincoln, USA
- Bo Wang, Motorola, USA
- Chonggang Wang, InterDigital Communications, USA
- Dan Wang, The Hong Kong Polytechnic University, Hong Kong
- Dandan Wang, Huawei Technology (USA lab), USA
- Jianfeng Wang, Philips Research, USA
- Jingning Wang, The 54th Research Institute of China Electronics Technology Group Corporation, P.R. China
- Kuang-Ching Wang, Clemson University, USA
- Li-Chun Wang, National Chiao Tung University, Taiwan
- Ping Wang, Nanyang Technological University, Singapore
- Pu Wang, Georgia Institute of Technology, USA
- Tianqi Wang, University of Rochester, USA
- Tsang-Yi Wang, National Sun Yat-sen University, Taiwan
- Wei Wang, South Dakota State University, USA
- Weichao Wang, University of North Carolina at Charlotte, USA
- Wenye Wang, NC State University, USA
- Xianbin Wang, University of Western Ontario, Canada
- Cedric Westphal, Docomo Labs USA, USA
- Adam Wolisz, Technical University of Berlin, Germany
- Stephen Wolthusen, Royal Holloway, University of London, United Kingdom
- Kai Kit Wong, University College London, United Kingdom
- Vincent Wong, University of British Columbia, Canada
- Jinsong Wu, Queen's University at Kingston, Canada
- Xuanli Wu, Communication Research Center, Harbin Institute of Technology, P.R. China
- Tadeusz Wysocki, University of Nebraska - Lincoln, USA
- Liudong Xing, University of Massachusetts Dartmouth, USA
- Fang Yang, International Communication and Navigation (ICAN) Corporation, Canada
- Yang Yang, Shanghai Research Center for Wireless Communications, P.R. China
- Fei Ye, University Washington, USA
- Qiang Ye, University of Prince Edward Island, Canada
- Amr Youssef, Concordia University, Canada
- Moustafa Youssef, Egypt-Japan University of Science and Technology (E-JUST), Egypt
- Mei Yu, Tianjin University, P.R. China
- Qiyue Yu, Harbin Institute of Technology, P.R. China
- Wei Yuan, Huazhong University of Science and Technology, P.R. China
- Andrea Zanella, University of Padova, Italy
- Sherali Zeadally, University of the District of Columbia, USA
- Seyed (Reza) Zekavat, Michigan Technological University, USA
- Qing-An Zeng, North Carolina A&T State University, USA
- Baoxian Zhang, Graduate University of the Chinese Academy of Sciences, P.R. China
- Wei-Yi Zhang, North Dakota State University, USA
- Yongbing Zhang, University of Tsukuba, Japan
- Dongmei Zhao, McMaster University, Canada
- Jun Zheng, Southeast University, P.R. China
- Chi Zhou, Illinois Institute of Technology, USA
- Yuan Zhou, Huawei Technologies Co. Ltd, P.R. China
- Hao Zhu, Florida International University, USA
- Weihua Zhuang, University of Waterloo, Canada