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TPC members for Wireless Networking Symposium (WNS)

  • Najah Abu Ali, UAE University, UAE
  • Ahmed Ahmed, Zagazig University, Egypt
  • Wessam Ajib, Université du Québec ä Montréal, Canada
  • Arafat Al-Dweik, Khalifa University, UAE
  • Attahiru Alfa, University of Manitoba, Canada
  • Ali Almutairi, Kuwait University, Kuwait
  • Nayef Alsindi, Bahrain Telecommunications Regulatory Authority, Bahrain
  • Salah Aly, Princeton University, USA
  • Habib M. Ammari, Hofstra University, USA
  • Tricha Anjali, Illinois Institute of Technology, USA
  • Huseyin Arslan, University of South Florida, USA
  • Nils Aschenbruck, University of Bonn, Germany
  • Mohammed Atiquzzaman, University of Oklahoma, USA
  • Leonardo Badia, IMT Lucca Institute for Advanced Studies, Italy
  • Saewoong Bahk, Seoul National University, Korea
  • Ivan Bajic, Simon Fraser University, Canada
  • Qutub Bakhtiar, Technological University of America, USA
  • Mohammad Banat, Jordan University of Science and Technology, Jordan
  • Luis Barbosa, Universidad de Castilla La Mancha, Spain
  • Uthman Baroudi, King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia
  • Mostafa Bassiouni, University of Central Florida, USA
  • Gerhard Bauch, Universitaet der Bundeswehr Munich, Germany
  • Osama Bazan, Ryerson University, Canada
  • Lotfi Benmohamed, Johns Hopkins University Applied Physics Laboratory, USA
  • Mauro Biagi, Sapienza University of Rome, Italy
  • Aggelos Bletsas, Technical University of Crete, Greece
  • Steven Blostein, Queen's University, Canada
  • Fernando Boavida, University of Coimbra, Portugal
  • Ali Boudani, DIGIPORT, France
  • Mohammed Boulmalf, AlAkhawayn University in Ifrane, Morocco
  • Chiara Buratti, University of Bologna, Italy
  • Jianfei Cai, Nanyang Technological University, Singapore
  • Jun Cai, University of Manitoba, Canada
  • Lin Cai, University of waterloo, Canada
  • Jiannong Cao, Hong Kong Polytechnic Univ, Hong Kong
  • Lei Cao, The University of Mississippi, USA
  • Claudio Casetti, Politecnico di Torino, Italy
  • Erdal Cayirci, University of Stavanger, Norway
  • Shih Yu Chang, National Tsing Hua University of Taiwan, Taiwan
  • Hui Chen, Virginia State University, USA
  • Jiming Chen, Zhejiang University, P.R. China
  • Xi Chen, Memorial University of Newfoundland, Canada
  • Xianbo Chen, Broadcom Corporation, USA
  • Xiangqian Chen, Florida International University, USA
  • Xiao Chen, Texas State University, USA
  • Yu Chen, State University of New York - Binghamton, USA
  • Yuanzhu Chen, Memorial University of Newfoundland, Canada
  • Yunfei Chen, University of Warwick, United Kingdom
  • Zesheng Chen, Indiana University - Purdue University Fort Wayne, USA
  • Ho Ting Cheng, Huawei Technologies Canada, Canada
  • Julian Cheng, University of British Columbia, Canada
  • Feng-Tsun Chien, National Chiao Tung University, Taiwan
  • Tzi-Dar Chiueh, National Taiwan University, Taiwan
  • Justin Coon, Toshiba TRL, United Kingdom
  • Laura Cottatellucci, Eurecom, France
  • Felipe Cruz-Pérez, Cinvestav-IPN, Mexico
  • Saumitra Das, Qualcomm Inc, USA
  • Luca De Nardis, University of Rome La Sapienza, Italy
  • Prathapasinghe Dharmawansa, Hong Kong University of Science and Technology, Hong Kong
  • Marco Di Renzo, French National Center for Scientific Research (CNRS), France
  • Mehrdad Dianati, University of Surrey, United Kingdom
  • Wei Ding, Austin Peay State University, USA
  • Min Dong, University of Ontario Institute of Technology, Canada
  • Yu Dong, Florida International University, USA
  • Chunjie Duan, Mitsubishi Electric Research Laboratories, USA
  • Arjan Durresi, Indiana University Purdue University Indianapolis, USA
  • Ehab Elmallah, University of Alberta, Canada
  • Khaled Elsayed, Cairo University, Egypt
  • Lorenzo Favalli, University of Pavia, Italy
  • Gianluigi Ferrari, University of Parma, Italy
  • Chuan Heng Foh, Nanyang Technological University, Singapore
  • Shengli Fu, University of North Texas, USA
  • Weihuang Fu, University of Cincinnati, USA
  • Yasser Gadallah, UAE University, Egypt
  • Laura Galluccio, University of Catania, Italy
  • Weihua Gao, Qualcomm Inc., USA
  • Thierry Gayraud, LAAS-CNRS, Université de Toulouse, France
  • Paul Gendron, SSC-Pacific, USA
  • Wolfgang Gerstacker, University of Erlangen-Nuernberg, Germany
  • Khalida Ghanem, University of Southampton and University of Birmingham, United Kingdom
  • Sahar Ghanem, Alexandria University, Egypt
  • Paolo Giacomazzi, Politecnico di Milano, Italy
  • Wesley Gifford, IBM Research, USA
  • Kartik Gopalan, State University of New York at Binghamton, USA
  • Javier Gozalvez, Universidad Miguel Hernandez de Elche, Spain
  • Mina Guirguis, Texas State University, USA
  • Martin Haardt, Ilmenau University of Technology, Germany
  • Yassine Hadjadj-Aoul, University of Rennes 1, France
  • Petr Hanacek, Brno University of Technology, Czech Republic
  • Mohammad Heidari, Skyhook Wireless, USA
  • Dominic K. C. Ho, University of Missouri - Columbia, USA
  • Liang Hong, Tennessee State University, USA
  • Xiaoyan Hong, University of Alabama, USA
  • Zhihong Hong, Communications Research Centre, Canada
  • Ekram Hossain, University of Manitoba, Canada
  • Fen Hou, The Chinese University of Hong Kong, Hong Kong
  • Xiaolin Hou, DOCOMO Beijing Communications Laboratories Co., Ltd, P.R. China
  • Steve Hranilovic, McMaster University, Canada
  • Rose Qingyang Hu, Utah State University, USA
  • Cunqing Hua, Zhejiang University, P.R. China
  • Defeng Huang, University of Western Australia, Australia
  • Dijiang Huang, Arizona State University, USA
  • Weimin Huang, Memorial University, Canada
  • Brian Hughes, North Carolina State University, USA
  • Ali Humos, Jackson State University, USA
  • Salama Ikki, INRS, Canada
  • Gi-Hong Im, POSTECH, Korea
  • Lillykutty Jacob, National Institute of Technology Calicut, India
  • Sarangapani Jagannathan, Missouri University of Science and Technology, USA
  • Muhammad Jaseemuddin, Ryerson University, Canada
  • Weijia Jia, City University of Hong Kong, P.R. China
  • Xiaohua Jia, City University of Hong Kong, Hong Kong
  • Vana Kalogeraki, University of California, Riverside, Greece
  • Charles Kamhoua, Florida International University, USA
  • Jaewon Kang, Telcordia Technologies, USA
  • George Karagiannidis, Aristotle University of Thessaloniki, Greece
  • Masoumeh Karimi, Technological University of America (TUA), USA
  • Andreas J. Kassler, Karlstad University, Sweden
  • Pete Keleher, University of Maryland, USA
  • Tamer Khattab, Qatar University, Qatar
  • Dong In Kim, Sungkyunkwan University, Korea
  • Pansoo Kim, ETRI, Korea
  • Joerg Kliewer, New Mexico State University, USA
  • Adrian Kliks, Poznan University of Technology, Poland
  • Thanasis Korakis, Polytechnic Institute of New York University, USA
  • Polychronis Koutsakis, Technical University of Crete, Greece
  • Ioannis Krikidis, University of Cyprus, Cyprus
  • Witold Krzymień, University of Alberta / TRLabs, Electrical and Computer Engineering, Canada
  • Adlen Ksentini, University of Rennes 1 / IRISA Lab, France
  • Rakhesh Kshetrimayum, Indian Institute of Technology Guwahati, India
  • Parag Kulkarni, Toshiba Research Europe Ltd., United Kingdom
  • Thomas Kunz, Carleton University, Canada
  • Yu-Kwong Kwok, University of Hong Kong, Hong Kong
  • Miguel Labrador, University of South Florida, USA
  • Yuri Labrador, Univision/FIU, USA
  • Abderrahmane Lakas, UAEU, UAE
  • Kaddar Lamia, University of Versailles Saint Quentin, France
  • David Laurenson, The University of Edinburgh, United Kingdom
  • Long Le, University of Quebec, Canada
  • Long Le, NEC Laboratories Europe, Germany
  • Zander Lei, Institute for Infocomm Research, Singapore
  • Cheng Li, Memorial University of Newfoundland, Canada
  • Hongxiang Li, North Darkota State University, USA
  • Husheng Li, University of Tennessee, USA
  • Jingli Li, TopWorx, USA
  • Minming Li, City University of Hong Kong, Hong Kong
  • Tiffany Jing Li, Lehigh University, USA
  • Xu Li, State University of New York at Buffalo, USA
  • Teng Joon Lim, University of Toronto, Canada
  • Di Lin, McGill University, Canada
  • Marco Listanti, University of Rome "La Sapienza", Italy
  • Hai Liu, Hong Kong Baptist University, Hong Kong
  • Qin Liu, Wuhan University, P.R. China
  • Tsung-Hsien Liu, National Chung Cheng University, Taiwan
  • Wei Liu, Huazhong University of Science and Technology, P.R. China
  • Renato Lo Cigno, University of Trento, Italy
  • David Love, Purdue University, USA
  • Xiaoning Lu, Qualcomm, USA
  • Marco Luise, University of Pisa, Italy
  • Chung-Horng Lung, Carleton University, Canada
  • Maurizio Magarini, Politecnico di Milano, Italy
  • Dario Maggiorini, University of Milano, Italy
  • Petri Mähönen, RWTH Aachen University, Germany
  • Shiwen Mao, Auburn University, USA
  • Patrick Marsch, Technische Universität Dresden, Germany
  • Peter Martini, University of Bonn, Germany
  • Barbara Masini, IEIIT-CNR, Italy
  • Christos Masouros, Queen's University Belfast, United Kingdom
  • Ahmed Meddahi, Institut Telecom/Telecom Lille 1, France
  • Muralidhar Medidi, Boise State University, USA
  • Sirisha Medidi, Boise State University, USA
  • Natarajan Meghanathan, Jackson State University, USA
  • Ahmed Mehaoua, University of Paris - Descartes, France
  • Neelesh Mehta, Indian Institute of Science, India
  • Jan Mietzner, EADS Deutschland GmbH, Germany
  • Daniele Miorandi, Create-Net, Italy
  • Vojislav Mišić, Ryerson University, Computer Science, Canada
  • Satyajayant Misra, New Mexico State University, USA
  • Amin Mobasher, Research In Motion, Canada
  • Amr Mohamed, Qatar University, Qatar
  • Seshadri Mohan, University of Arkansas at Little Rock, USA
  • Hamed Mohsenian-Rad, Texas Tech University, USA
  • Lizdabel Morales-Tirado, University of Puerto Rico, USA
  • Stefan Moser, National Chiao Tung University (NCTU), Taiwan
  • Ahmed Mostefaoui, University of Franche-Comté, France
  • Lorenzo Mucchi, University of Florence, Italy
  • Amitava Mukherjee, IBM India Pvt Ltd, Calcutta, India
  • Kumudu Munasinghe, University of Sydney, Australia
  • Amir Masoud Nasri Nasrabadi, University of British Columbia, Canada
  • Edith Ngai, Uppsala University, Sweden
  • Dragos Niculescu, Universitatea POLITEHNICA Bucuresti, Romania
  • Ioanis Nikolaidis, University of Alberta, Canada
  • Mirela Notare, Barddal University, Brazil
  • Mohammad S. Obaidat, Monmouth University, USA
  • Stephan Olariu, Old Dominion University, USA
  • Frank Oldewurtel, RWTH Aachen University, Germany
  • Shumao Ou, Oxford Brookes University, United Kingdom
  • Ertan Özürk, Zonguldak Karaelmas University, Turkey
  • Sangheon Pack, Korea University, Korea
  • Elena Pagani, University of Milano, Italy
  • Zhengang Pan, University of Hong Kong, Hong Kong
  • Evangelos Papapetrou, University of Ioannina, Greece
  • Gianni Pasolini, IEIIT-BO/CNR, University of Bologna, Italy
  • Dongming Peng, University Nebraska - Lincoln, USA
  • Wuxu Peng, Texas State University, USA
  • Dirk Pesch, Cork Institute of Technology, Ireland
  • Chiara Petrioli, University of Rome "La Sapienza", Italy
  • Tom Pfeifer, Waterford Institute of Technology, TSSG, Ireland
  • Lorenzo Piazzo, Universita' di Roma "La Sapienza", Italy
  • Pedro Pinto, Massachusetts Institute of Technology, USA
  • Niki Pissinou, Florida International University, USA
  • Anand Prasad, NEC Corporation, Japan
  • R Venkatesha Prasad, TU Delft - Delft University of Technology, The Netherlands
  • Xin Qiu, Harbin Institute of Technology, P.R. China
  • Guangzhi Qu, Oakland University, USA
  • Redha Radaydeh, KAUST, Saudi Arabia
  • Dinesh Rajan, Southern Methodist University, USA
  • Marco Roccetti, University of Bologna, Italy
  • Dario Rossi, TELECOM ParisTech, France
  • Michele Rossi, University of Padova, Italy
  • Brian Sadler, Army Research Laboratory, USA
  • Djamel Sadok, Federal University of Pernambuco, Brazil
  • Ehssan Sakhaee, Osaka University, Japan
  • Farag Sallabi, UAE University, UAE
  • Wiroonsak Santipach, Kasetsart University, Thailand
  • Cesar Santivanez, BBN Technologies, USA
  • Jochen Schiller, FU Berlin, Germany
  • Jens Schmitt, University of Kaiserslautern, Germany
  • Debarati Sen, Samsung India Software Operations, India
  • Sidi-Mohammed Senouci, University of Bourgogne - ISAT Nevers, France
  • Xuejun Sha, Communication Research Center, Harbin Institute of Technology, P.R. China
  • Abdallah Shami, The University of Western Ontario, Canada
  • Hangguan Shan, University of Waterloo, Canada
  • Yi Shang, University of Missouri, USA
  • Sanaa Sharafeddine, Lebanese American University, Lebanon
  • Tarek Sheltami, KFUPM, Saudi Arabia
  • Yi Shi, Virginia Tech, USA
  • Claudio Silva, Virginia Tech, USA
  • Isabelle Simplot-Ryl, University of Lille/INRIA, France
  • Krishna Sivalingam, Indian Institute of Technology Madras, India
  • Wei Song, University of New Brunswick, Canada
  • Wen-Zhan Song, Georgia State University, USA
  • Thomas Stockhammer, Nomor Research GmbH, Germany
  • Zhou Su, Waseda University, Japan
  • Hongxia Sun, University of Calgary, Canada
  • Akshya Swain, University of Auckland, New Zealand
  • Violet Syrotiuk, Arizona State University, USA
  • Abd-Elhamid Taha, Queen's University, Canada
  • Glen Takahara, Queen's University, Canada
  • Mineo Takai, University of California, Los Angeles, USA
  • Tarik Taleb, NEC Europe Ltd., Germany
  • Jian Tang, Syracuse University, USA
  • Daniele Tarchi, University of Bologna, Italy
  • Chintha Tellambura, University of Alberta, Canada
  • Ilenia Tinnirello, University of Palermo, Italy
  • Jens Toelle, Fraunhofer FKIE / University of Bonn, Germany
  • Andrea Tonello, University of Udine, Italy
  • Ali Tosun, University of Texas at San Antonio, USA
  • Stavros Toumpis, Athens University of Economics and Business, Greece
  • Chih-Cheng Tseng, National Ilan University, Taiwan
  • Hiroshi Tsunoda, Tohoku Institue of Technology, Japan
  • Suleyman Uludag, The University of Michigan - Flint, USA
  • Sennur Ulukus, University of Maryland, USA
  • Fabrice Valois, INSA Lyon, France
  • Athanasios Vasilakos, University of Western Macedonia, Greece
  • Padmini Vellore, Memorial University of Newfoundland, Canada
  • Véronique Vèque, University of Paris-Sud 11, France
  • Mehmet Vuran, University of Nebraska-Lincoln, USA
  • Bo Wang, Motorola, USA
  • Chonggang Wang, InterDigital Communications, USA
  • Dan Wang, The Hong Kong Polytechnic University, Hong Kong
  • Dandan Wang, Huawei Technology (USA lab), USA
  • Jianfeng Wang, Philips Research, USA
  • Jingning Wang, The 54th Research Institute of China Electronics Technology Group Corporation, P.R. China
  • Kuang-Ching Wang, Clemson University, USA
  • Li-Chun Wang, National Chiao Tung University, Taiwan
  • Ping Wang, Nanyang Technological University, Singapore
  • Pu Wang, Georgia Institute of Technology, USA
  • Tianqi Wang, University of Rochester, USA
  • Tsang-Yi Wang, National Sun Yat-sen University, Taiwan
  • Wei Wang, South Dakota State University, USA
  • Weichao Wang, University of North Carolina at Charlotte, USA
  • Wenye Wang, NC State University, USA
  • Xianbin Wang, University of Western Ontario, Canada
  • Cedric Westphal, Docomo Labs USA, USA
  • Adam Wolisz, Technical University of Berlin, Germany
  • Stephen Wolthusen, Royal Holloway, University of London, United Kingdom
  • Kai Kit Wong, University College London, United Kingdom
  • Vincent Wong, University of British Columbia, Canada
  • Jinsong Wu, Queen's University at Kingston, Canada
  • Xuanli Wu, Communication Research Center, Harbin Institute of Technology, P.R. China
  • Tadeusz Wysocki, University of Nebraska - Lincoln, USA
  • Liudong Xing, University of Massachusetts Dartmouth, USA
  • Fang Yang, International Communication and Navigation (ICAN) Corporation, Canada
  • Yang Yang, Shanghai Research Center for Wireless Communications, P.R. China
  • Fei Ye, University Washington, USA
  • Qiang Ye, University of Prince Edward Island, Canada
  • Amr Youssef, Concordia University, Canada
  • Moustafa Youssef, Egypt-Japan University of Science and Technology (E-JUST), Egypt
  • Mei Yu, Tianjin University, P.R. China
  • Qiyue Yu, Harbin Institute of Technology, P.R. China
  • Wei Yuan, Huazhong University of Science and Technology, P.R. China
  • Andrea Zanella, University of Padova, Italy
  • Sherali Zeadally, University of the District of Columbia, USA
  • Seyed (Reza) Zekavat, Michigan Technological University, USA
  • Qing-An Zeng, North Carolina A&T State University, USA
  • Baoxian Zhang, Graduate University of the Chinese Academy of Sciences, P.R. China
  • Wei-Yi Zhang, North Dakota State University, USA
  • Yongbing Zhang, University of Tsukuba, Japan
  • Dongmei Zhao, McMaster University, Canada
  • Jun Zheng, Southeast University, P.R. China
  • Chi Zhou, Illinois Institute of Technology, USA
  • Yuan Zhou, Huawei Technologies Co. Ltd, P.R. China
  • Hao Zhu, Florida International University, USA
  • Weihua Zhuang, University of Waterloo, Canada




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